BS ISO 13424:2013
$198.66
Surface chemical analysis. X-ray photoelectron spectroscopy. Reporting of results of thin-film analysis
Published By | Publication Date | Number of Pages |
BSI | 2013 | 58 |
This International Standard specifies the minimum amount of information required in reports of analyses of thin films on a substrate by XPS. These analyses involve measurement of the chemical composition and thickness of homogeneous thin films, and measurement of the chemical composition as a function of depth of inhomogeneous thin films by angle-resolved XPS, XPS sputter-depth profiling, peak-shape analysis, and variable photon energy XPS.
PDF Catalog
PDF Pages | PDF Title |
---|---|
6 | Foreword |
7 | Introduction |
9 | Section sec_1 Section sec_2 Section sec_3 Section sec_4 Section sec_5 Section sec_5.1 1 Scope 2 Normative references 3 Terms and definitions 4 Abbreviated terms 5 Overview of thin-film analysis by XPS 5.1 Introduction |
10 | Table tab_1 |
11 | Section sec_5.2 Section sec_5.3 Section sec_5.4 Section sec_5.5 Section sec_5.6 5.2 General XPS 5.3 Angle-resolved XPS 5.4 Peak-shape analysis 5.5 Variable photon energy XPS 5.6 XPS with sputter-depth profiling |
12 | Section sec_6 Section sec_7 Section sec_7.1 Section sec_7.2 Section sec_7.2.1 Section sec_7.2.2 Section sec_7.2.3 Section sec_7.2.4 6 Specimen handling 7 Instrument and operating conditions 7.1 Instrument calibration 7.2 Operating conditions |
13 | Section sec_8 Section sec_8.1 Section sec_8.2 Section sec_8.2.1 Section sec_8.2.2 Section sec_8.2.3 Section sec_8.2.4 8 Reporting XPS method, experimental conditions, analysis parameters, and analytical results 8.1 XPS method for thin-film analysis 8.2 Experimental conditions |
14 | Section sec_8.2.5 Section sec_8.2.6 Section sec_8.2.7 Section sec_8.3 Section sec_8.3.1 Section sec_8.3.2 8.3 Analysis parameters |
15 | Section sec_8.3.3 Section sec_8.3.4 Section sec_8.3.5 Section sec_8.3.6 Section sec_8.4 Table tab_2 8.4 Examples of summary tables |
17 | Table tab_3 Section sec_8.5 8.5 Analytical Results |
18 | Annex sec_A Annex sec_A.1 Annex sec_A.2 Annex A (informative) General XPS |
20 | Annex sec_A.3 |
22 | Annex sec_A.4 Annex sec_A.5 |
23 | Annex sec_A.5.1 |
24 | Figure fig_A.1 Table tab_A.1 |
25 | Figure fig_A.2 |
26 | Annex sec_B Annex sec_B.1 Annex sec_B.2 Annex B (informative) Angle-resolved XPS |
27 | Annex sec_B.3 |
29 | Annex sec_B.3.1 |
30 | Annex sec_B.3.2 Annex sec_B.3.3 Annex sec_B.3.4 Annex sec_B.4 |
31 | Figure fig_B.1 |
32 | Annex sec_C Annex sec_C.1 Annex sec_C.2 Annex C (informative) Peak-shape analysis |
33 | Figure fig_C.1 Annex sec_C.3 |
34 | Figure fig_C.2 Annex sec_C.3.1 |
35 | Annex sec_C.3.2 Figure fig_C.3 |
36 | Table tab_C.1 Annex sec_C.3.3 Table tab_C.2 |
38 | Figure fig_C.4 Annex sec_C.3.4 |
41 | Table tab_C.3 |
42 | Figure fig_C.5 Table tab_C.4 |
44 | Figure fig_C.6 |
45 | Annex sec_D Annex sec_D.1 Annex sec_D.2 Annex sec_D.3 Annex D (informative) XPS with sputter-depth profiling |
46 | Figure fig_D.1 |
47 | Figure fig_D.2 |
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