BSI 20/30409140 DC:2020 Edition
$13.70
BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 10 |
| Status | Definitive |
|---|---|
| Pages | 10 |
| Publication Date | 2020-04-22 |
| Standard Number | 20/30409140 DC |
| Title | BS IEC 61189-2-807. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807. Test methods for materials for interconnection structures. Decomposition Temperature (Td) using TGA |
| Identical National Standard Of | 91/1647/CD |
| Descriptors | Testing methods, Printing board, Open systems interconnection, Structures |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 35.100.01 - Open systems interconnection in general |
