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BSI 21/30446636 DC:2021 Edition

BSI 21/30446636 DC:2021 Edition

$13.70

BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808. Thermal resistance of an assembly by thermal transient method

Published By Publication Date Number of Pages
BSI 2021 18
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Status

Definitive
Pages

18
Publication Date

2021-10-29
Standard Number

21/30446636 DC
Title

BS EN IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808. Thermal resistance of an assembly by thermal transient method
Identical National Standard Of

IEC 61189-2-808 ED1
Descriptors

Printing board, Structures, Testing methods, Open systems interconnection
Publisher

BSI
Committee

EPL/501
ICS Codes 35.100.01 - Open systems interconnection in general

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BSI 21/30446636 DC
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