BSI 23/30436874 DC 2023
$13.70
BS EN IEC 62878-2-603. Device embedding assembly technology – Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity
Published By | Publication Date | Number of Pages |
BSI | 2023 | 14 |
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PDF Catalog
PDF Pages | PDF Title |
---|---|
5 | FOREWORD |
7 | INTRODUCTION |
8 | 1 Scope 2 Normative references 3 Terms definitions and abbreviated terms 3.1 Terms and definitions 3.2 Abbreviated terms Terms and definitions 4 General |
10 | 5 Test specimen 5.1 General 5.2 Preparation of test specimen |
11 | 6 Test apparatus |
12 | 7 Test method and test procedure 7.1 General |
Status | Definitive |
---|---|
Pages | 14 |
Publication Date | 2023-10-23 |
Standard Number | 23/30436874 DC |
Title | BS EN IEC 62878-2-603. Device embedding assembly technology – Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity |
Publisher | BSI |
Committee | EPL/501 |
ICS Codes | 31.180 - Printed circuits and boards |
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