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BSI 24/30488910 DC:2024 Edition

BSI 24/30488910 DC:2024 Edition

$13.70

BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Published By Publication Date Number of Pages
BSI 2024 18
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PDF Catalog

PDF Pages PDF Title
6 FOREWORD
8 1. Scope
2. 2.Normative references
3. Terms and definitions
4. Test principle
9 5. Equipment
5.1 X-ray CT scanner
5.1.1X-ray source system
5.1.2 Mechanical Scanning Systems
5.1.3 Detector Systems
5.1.4 Shielding Facilities
5.2 Software Systems
6. Test environment
10 7. Test the steps
7.1 Equipment Preparation
7.2 Sample clamping
7.3 Parameter Settings
7.3.1 X-ray sources
7.3.2 Scanning Methods
7.3.3 Scanning the Field of View
7.3.4 Number of Frames Scanned
7.3.5 Scan Time
11 7.4 Scanning
7.5 Image Reconstruction
7.5.1 3D Reconstruction
7.5.2 Image Quality
7.5.3 Visualization
7.5.4 Image Analysis and data processing
7.5.5 Image Saving
8. Reports
8.1 Basic Information
8.2 Device Information
8.3 Sample Information
8.4 Sweep Parameters
12 8.5 Measurement results
13 A.1 Typical image of plating voids
A.2 Typical image of copper filling defects
A.3 Typical image of rough plating
14 A.4 Typical image of nodulation
A.5 Typical image of plating folds
A.6 Typical image of interlayer coincidence
16 B.1 Void Identification
B.1.1 Principle
B.1.2 Via
B.1.3 Fill hole
17 B.2 Statistical analysis
B.2.1 Number of voids
B.2.2 Calculated the maximum length of the voids/board thickness ratio
B.2.3 Calculated filled holes void rate
18 Bibliography

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BSI 24/30488910 DC
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