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BSI 24/30492188 DC:2024 Edition

BSI 24/30492188 DC:2024 Edition

$13.70

Draft BS EN 63378-6 ED1. Thermal standardization on semiconductor packages – Part 6. Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

Published By Publication Date Number of Pages
BSI 2024 32
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PDF Catalog

PDF Pages PDF Title
6 FOREWORD
8 INTRODUCTION
9 1 Scope
2 Normative references
3 Terms and definitions
11 4 Definition of DXRC
4.1 General
4.2 Thermal Resistance and Capacitance (RC) topology of DXRC
4.2.1 Thermal RC topology of DXRC
4.2.2 Outline of DXRC
12 4.2.3 RC values on NJA-RC
4.2.4 RC values on MPA-RC
14 Annex A (informative) Accuracy Verification of DXRC model for TO-252
A.1 General
A.2 CFD Model
16 A.3 Calculation of thermal RC values
17 A.4 MPA-RC and DXRC model outline
A.5 Optimization of RC values in MPA-RC
18 A.6 Result
20 Annex B (informative) Accuracy Verification of DXRC model for TO-263
B.1 General
B.2 CFD Model
22 B.3 Calculation of thermal RC values
23 B.4 MPA-RC and DXRC model outline
B.5 Optimization of RC values in MPA-RC
24 B.6 Result
25 Annex C (informative) Accuracy Verification of DXRC model for HSOP
C.1 General
C.2 CFD Model
26 C.3 Calculation of thermal RC values
28 C.4 MPA-RC and DXRC model outline
C.5 Optimization of RC values in MPA-RC
29 C.6 Result
30 Annex D (informative) The effect of PCB layers
D.1 General
D.2 Verification Method
D.3 Result
32 Bibliography

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BSI 24/30492188 DC
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