BSI PD ES 59008-4-1:2001
$86.31
Data requirements for semiconductor die. Specific requirements and recommendations – Test and quality
| Published By | Publication Date | Number of Pages |
| BSI | 2001 | 14 |
This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die.
This Specification also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die.
ES 59008-4-1 specifies the requirements for the data needed to describe the test and quality parameters of the die.
Specifies requirements for the data needed to describe the test and quality parameters of semiconductor die and gives recommendations for general industry good practice.
