BSI PD IEC/PAS 62647-1:2011:2012 Edition
$142.49
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Lead-free management
Published By | Publication Date | Number of Pages |
BSI | 2012 | 24 |
IEC/PAS 62647-1:2011(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and high performance electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. The goal is to communicate requirements for a Lead-free Control Plan (LFCP) and to assist suppliers in the development of their own plans.
PDF Catalog
PDF Pages | PDF Title |
---|---|
4 | CONTENTS |
6 | FOREWORD |
8 | INTRODUCTION |
9 | 1 Scope 2 Normative references |
10 | 3 Terms and definitions |
12 | 4 Symbols and abbreviated terms 5 Objectives 5.1 General 5.2 Reliability 5.3 Configuration control and product identification 5.4 Risks and limitations of use 5.5 Deleterious effects of tin whiskers 5.6 Repair, rework, maintenance, and support 6 Technical requirements 6.1 General |
13 | 6.2 Reliability |
14 | 6.3 Configuration control and product identification |
16 | 6.4 Risks and limitations of use 6.5 Deleterious effects of tin whiskers 6.6 Repair, rework, maintenance, and support |
17 | 7 Plan administrative requirements 7.1 Plan organization 7.2 Terms and definitions |
18 | 7.3 Plan focal authority 7.4 References 7.5 Plan applicability 7.6 Plan implementation 7.7 Plan acceptance 7.8 Plan modifications |
19 | Figure 1 – Relationship of IEC/PAS 62647-1, IEC/PAS 62647-2, GEIA-HB-0005-1, and GEIA-HB-0005-2 with each other, and with information about Pb-free electronics from sources external to the aerospace and high performance electronics industries Figure 2 – Schematic diagram of the content of a performance plan compliant to IEC/PAS 62647-1 |
20 | Bibliography |