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BSI PD IEC TR 61191-7:2020

BSI PD IEC TR 61191-7:2020

$215.11

Printed board assemblies – Technical cleanliness of components and printed board assemblies

Published By Publication Date Number of Pages
BSI 2020 118
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This part of IEC 61191 serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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BSI PD IEC TR 61191-7:2020
$215.11