BSI PD IEC TR 61340-5-5:2018
$167.15
Electrostatics – Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 38 |
This part of IEC 61340 discusses packaging material requirements for electrostatic discharge sensitive items (ESDS) as well as non–ESDS which can apply to packaging materials such as embossed carrier tape, trays, tubes (stick magazines), rails and others used in back end line processing and parts handling where test methods described in other standards are, for the most part, inadequate. Issues related to electrostatic charge generation, electrostatic attraction and repulsion are included. The recommendations and discussions within this document can also be applicable to other types of packaging that cannot be evaluated by other means.
This document discusses the issues related to
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technical considerations for packaging material selection and packaging system design,
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packaging material specifications for electrostatic control,
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existing test methods and their limitations for packaging materials,
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suggestions for the evaluation of small dimension packaging materials, and
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industry common practices.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 7 | FOREWORD |
| 9 | INTRODUCTION |
| 10 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions |
| 11 | 3.2 Abbreviated terms |
| 12 | 4 Role of electrostatic protective packaging 4.1 Analysis of electrostatic risks (what can cause problems to ESDS) 4.2 Charge generation (separation) |
| 13 | Figures Figure 1 – Induction charging process – Grounding a conductorin the presence of an electrical field |
| 14 | Figure 2 – Second part of induction charging process Figure 3 – First discharge pulse that occurs as shown in Figure 1 b) Figure 4 – Second discharge pulse that occurs as shown in Figure 2 |
| 15 | 4.3 Reduction of electrostatic charging items in the environment 4.4 Electrostatic attraction and repulsion issues |
| 16 | 4.5 Dissipation of electrostatic charge 4.6 Barrier to ESD current 4.7 Protection against electrostatic fields 4.8 Chemical and outgassing issues |
| 17 | 4.9 Moisture barrier 4.10 Environmental conditions affecting packaging materials 4.11 Packaging material principles 4.11.1 General 4.11.2 Low charging 4.11.3 Electrostatic charge dissipation |
| 18 | 4.11.4 Conductive materials 4.11.5 Electrostatic field shielding 4.11.6 Electrostatic discharge shielding 5 Types of material 5.1 Filled polymers |
| 19 | 5.2 Intrinsically conductive or dissipative 5.3 Surface coated 5.4 Antistat treated 5.5 Anodized materials (e.g. boats used inside automated handlers, metal tubes) 5.6 Material processing 5.6.1 Vacuum forming 5.6.2 Injection moulding |
| 20 | 5.6.3 Embossing 5.6.4 Vacuum vapour deposition 5.6.5 Surface coating 5.6.6 Lamination 6 Existing standards for packaging materials 6.1 IEC 61340-5-3 6.2 ANSI/ESD S541 |
| 21 | 6.3 Military standards and other documents related to packaging 6.3.1 General 6.3.2 MIL PRF 81705 (E) (Film) 6.3.3 MIL STD 3010 6.3.4 MIL PRF 131 7 Existing test methods for packaging materials 7.1 IEC 61340-2-1 – Ability of materials and products to dissipate static electric charge |
| 22 | 7.2 IEC TR 61340-2-2 – Measurement of chargeability 7.3 IEC 61340-2-3 – Resistance and resistivity 7.4 IEC 61340-4-8 – Discharge shielding – Bags |
| 23 | 8 Choosing a packaging technology 8.1 Determining packaging material attributes 8.2 Inside an EPA 8.3 Outside an EPA or between EPAs 8.4 Evaluation of packaging system attributes 8.5 Charge dissipation test methods 8.6 Resistance measurement methods |
| 24 | 8.7 Shielding test 9 Does the packaging system meet the intended purpose? 10 New test method concepts and development plans 10.1 General Table 1 – Test methods for electrostatic protective packaging |
| 25 | 10.2 Single point probe 10.3 Parallel plates Figure 5 – Single point probe test method set-up Figure 6 – Single point probe on embossed (pocket) tape |
| 26 | 10.4 Pin-point probe 10.5 Shielding related test methods 10.6 Charge generation – Triboelectrification test methods Figure 7 – Parallel plate test method set-up |
| 27 | Figure 8 – Set-up of isolated tape reels Figure 9 – Resistance measurements – Reel to reel |
| 28 | 10.7 Triboelectric charging of cover tape Figure 10 – Charge drain test – Reel to reel Figure 11 – Cover tape evaluation concepts |
| 29 | 10.8 Discharge evaluation method 10.9 Other resistance test methods Figure 12 – Discharge evaluation method |
| 30 | Annex A (informative)Packaging forms and types A.1 Packaging materials for electronic devices A.2 Embossed tape A.3 Cover tape Figure A.1 – Examples of embossed (pocket) tape |
| 31 | A.4 Reel types and materials Figure A.2 – Cover tape Figure A.3 – Cover tape Figure A.4 – Cover tape Figure A.5 – Cover tape Figure A.6 – Cover tape Figure A.7 – Cover tape Figure A.8 – Cover tape |
| 32 | A.5 Injection moulded trays Figure A.9 – Reels Figure A.10 – Reels Figure A.11 – Reels Figure A.12 – Reels Figure A.13 – Trays Figure A.14 – Trays Figure A.15 –Trays |
| 33 | A.6 Tubes and rails and other configurations of packaging materials Figure A.16 – Trays Figure A.17– Trays Figure A.18 –Trays Figure A.19 – Trays Figure A.20 – Trays Figure A.21 – Trays Figure A.22 –Trays Figure A.23 – Trays |
| 34 | A.7 Clam shell and test socket A.8 Bags Figure A.24 – Tubes Figure A.25 – Tubes Figure A.26 Tubes Figure A.27 –Clam shells |
| 35 | A.9 Tote boxes and other rigid containers Figure A.28 – Static discharge shielding bag Figure A.29 Moisture barrier – Metal foil bags Figure A.30 – Moisture barrier – Metal vapour deposition Figure A.31 – Box Figure A.32 – Rigid container |
| 36 | Bibliography |
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BSI PD IEC TR 61340-5-5:2018
Electrostatics – Protection of electronic devices from electrostatic phenomena. Packaging systems used in electronic manufacturing…
