BSI PD IEC/TR 63072-1:2017
$198.66
Photonic integrated circuits – Introduction and roadmap for standardization
| Published By | Publication Date | Number of Pages |
| BSI | 2017 | 54 |
This part of IEC 63072, which is a Technical Report, provides an introduction to photonic integrated circuits (PICs) and describes a roadmap for the standardization of PIC technology over the next decade.
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PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | National foreword |
| 6 | CONTENTS |
| 9 | FOREWORD |
| 11 | 1 Scope 2 Normative references 3 Terms and definitions |
| 13 | 4 Photonic integrated circuit (PIC) 4.1 Overview |
| 15 | 4.2 PIC families 4.2.1 General Figures Figure 1 – Examples of PICs [1] |
| 16 | 4.2.2 Silicon photonics 4.2.3 III-V photonics 4.2.4 Silica and silicon nitride PICs Figure 2 – Optical beam forming network fabricated in TriPleX (silicon nitride) |
| 17 | 4.3 Manufacturing capabilities 4.4 Global market 4.5 Global government investment in PIC research and development 4.5.1 General 4.5.2 United States of America 4.5.3 Europe 4.5.4 Japan |
| 18 | 5 Silicon photonics 5.1 Overview 5.2 Integration schemes 5.2.1 General Figure 3 – Typical silicon waveguides [6] |
| 19 | 5.2.2 Heterogeneous integration 5.2.3 Homogenous integration 5.3 Non-linear behaviour 6 III-V photonics 6.1 Indium phosphide (InP) photonics Figure 4 – Heterogeneous integration by flip chip and copper pillars |
| 20 | Figure 5 – Indium phosphide PIC with many structures, including AWG |
| 21 | 7 PIC transceiver – A simple example 7.1 Overview 7.2 Transmitter section Figure 6 – Combined InP and TriPleX microwave photonic beam-forming network |
| 22 | 7.3 Receiver section Figure 7 – Schematic of four channel PIC transceiver by Luxtera [6] |
| 23 | 8 Optical sources 8.1 Overview 8.2 Advances in III-V integration onto silicon PICs |
| 24 | 8.3 Vertical cavity surface emitting lasers (VCSELs) 9 Optical receivers Figure 8 – Schematic view of 3D assembly of PIC + EIC electro-optical assembly [6] |
| 25 | 10 Modulators 10.1 Overview 10.2 Common modulator structures Figure 9 – Example of Ge-on-Si photodetector formed by germanium selective epitaxy [6] |
| 26 | 10.3 Plasma dispersion effect Figure 10 – High speed PN modulator [6] |
| 27 | 10.4 Plasmonics 10.5 Silicon organic hybrid Figure 11 – PETRA optical I/O core chip modulation scheme |
| 28 | 11 Switches 11.1 Overview 11.2 Mach-Zehnder interferometers (MZI) 11.3 Micro-ring resonator (MRR) Figure 12 – Silicon organic hybrid |
| 29 | 11.4 Double-ring assisted MZI (DR-MZI) 12 3D integration 12.1 Optochip 12.2 Through-silicon-vias (TSVs) Figure 13 – 4 x 4 switching matrix PIC attached to PCB with wire bonds on the EU FP7 PhoxTroT project |
| 30 | 12.3 Hybrid integration process example 12.4 Flip-chip bonding Figure 14 – EU FP7 project PhoxTroT 3D integrated optochip concept |
| 31 | 12.5 State of the art in 3D research and development 13 Commercial state of the art 13.1 Overview 13.2 Luxtera Figure 15 – LIFT principle |
| 32 | 13.3 Intel 13.4 Mellanox |
| 33 | 13.5 Oracle 13.6 IBM 13.7 Photonics Electronics Technology Research Association (PETRA) Figure 16 – PETRA optical I/O core performance at 25 Gb/s |
| 34 | 14 PIC coupling interfaces 14.1 Overview 14.2 Grating coupler |
| 35 | Figure 17 – Examples of vertical grating couplers [6] |
| 36 | Figure 18 – Coupling efficiency of single polarization grating coupler (SPGC) at 1 310 nm and 1 490 nm [91] Figure 19 – Composite coupling interfaces on PETRA optical I/O core |
| 37 | 14.3 Adiabatic coupling Figure 20 – Assembly for adiabatic optical coupling between Si photonics chip and SM polymer waveguide |
| 38 | Figure 21 – Flip-chipped silicon photonic chip onto polymer waveguide substrate using adiabatic coupling |
| 39 | 14.4 Butt coupling 14.5 Orthogonal chip-to-fibre coupling Figure 22 – Bidirectional optical coupling between SOI waveguides and single polymer waveguides |
| 40 | 15 Electrical interface Figure 23 – Design of the mirror plug assembly |
| 41 | 16 Packaging 17 Standardization roadmap Figure 24 – Typical operative framework of silicon-photonics modules |
| 42 | Figure 25 – PIC standardization roadmap |
| 43 | Bibliography |
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BSI PD IEC/TR 63072-1:2017
Photonic integrated circuits – Introduction and roadmap for standardization Published By Publication Date Number of…
