BSI PD IEC TR 63362-1:2022

$142.49

Application of fixed capacitors in electronic equipment – Part 1: Aluminium electrolytic capacitors

Published By	Publication Date	Number of Pages
BSI	2022	30

Guaranteed Safe Checkout

Categories: 31.060.50 - Aluminium electrolytic capacitors, BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

PDF Catalog

PDF Pages	PDF Title
2	undefined
4	CONTENTS
7	FOREWORD
9	1 Scope 2 Normative references 3 Terms and definitions
10	4 Protection measures – insulation
11	5 General application limits 5.1 Polarity – Reverse voltage 5.2 Voltage 5.2.1 General 5.2.2 Rated voltage 5.2.3 Surge voltage 5.2.4 Transient voltages 5.3 Temperature range
12	5.4 Ripple current 5.5 Charge – Discharge 6 Storage, transportation, and operation
13	7 External pressure (not relevant for capacitors with solid electrolyte) 7.1 Low air pressure 7.2 High air pressure 8 Self-recharge phenomenon (dielectric absorption) 9 Flammability (passive and active) 9.1 General 9.2 Passive flammability
14	9.3 Active flammability 10 Internal pressure and pressure relief device 11 Working electrolytes and contact with an electrolyte
15	12 Parallel and series connection of capacitors 12.1 General 12.2 Voltage sharing between devices 12.3 Circuit configuration Figures Figure 1 – Individual balancing resistors
16	12.4 Balancing resistors for voltage sharing 12.4.1 General Figure 2 – Common centre connection Figure 3 – Group-balancing resistors
17	12.4.2 Voltage sharing analysis Figure 4 – Voltage sharing analysis
18	12.4.3 Resistor tolerance 12.4.4 Choice of resistor value
19	12.5 Component failure 13 Clearance and creepage distances 13.1 Distances inside the capacitor 13.2 Distances outside the capacitor Table 1 – Balancing examples
20	14 Capacitor mounting 14.1 General conditions for mounting 14.1.1 Mounting position 14.1.2 Polarity indication 14.1.3 Hole/pad distance 14.1.4 Position of the pressure relief device
21	14.1.5 Board holes under the insulation 14.1.6 Double-sided printed circuit boards 14.1.7 Case polarity 14.2 Component preparation 14.3 Mounting 14.3.1 Discharging 14.3.2 Ratings and polarity 14.3.3 Lead stress 14.3.4 Fixing torque
22	14.3.5 Capacitor fixing 14.4 Soldering 14.4.1 Preheat temperature 14.4.2 Soldering temperature and duration 14.4.3 Care after soldering 14.5 Transport and handling of assembled devices 15 Cleaning solvents and processes 15.1 General 15.2 Cleaning solvents 15.2.1 Halogenated solvents (e.g. CFC)
23	15.2.2 Halogenated hydrocarbons 15.2.3 Aqueous solutions 15.2.4 Alcohols 15.2.5 Alkaline solvents 15.2.6 Other cleaning solvents 15.3 Cleaning of circuit board 15.3.1 Cleaning processes
24	15.3.2 Process control during cleaning 15.3.3 Process control after cleaning 15.3.4 Other precautions 16 Potting and gluing 16.1 General
25	16.2 Potting and gluing materials 16.3 Curing process 17 Selection of capacitors and failure mechanisms during overload 17.1 Selection 17.1.1 General 17.1.2 Selection based on operating conditions 17.1.3 Selection based on shapes and assembly conditions
26	17.2 Failure mechanisms during overload (especially details under overvoltage load conditions) 17.2.1 Overview 17.2.2 Failure mechanisms – details Figure 5 – Degradation mechanisms
27	18 Disposal of capacitors
28	Bibliography