BSI PD IEC/TS 62239-1:2015
$215.11
Process management for avionics. Management plan – Preparation and maintenance of an electronic components management plan
| Published By | Publication Date | Number of Pages |
| BSI | 2015 | 82 |
This part of IEC 62239 , which is a technical specification, defines the requirements for developing an Electronic Components Management Plan (ECMP) to assure customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished.
In general, the plan owner of a complete Electronic Components Management Plan is the avionics original equipment manufacturer (OEM).
This document provides an aid in the aerospace certification process.
Although developed for the avionics industry, this process may be applied by other industrial sectors.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 6 | FOREWORD |
| 8 | INTRODUCTION |
| 9 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations |
| 10 | 3.1 Terms and definitions |
| 14 | 3.2 Abbreviations |
| 15 | 4 Technical requirements 4.1 General |
| 16 | 4.2 Component selection 4.2.1 General 4.2.2 Application conditions for use 4.2.3 Availability and durability 4.2.4 Additional performance 4.2.5 Component identification |
| 17 | 4.3 Component application 4.3.1 General 4.3.2 Electromagnetic compatibility (EMC) 4.3.3 Derating and stress analysis |
| 18 | 4.3.4 Thermal analysis |
| 19 | 4.3.5 Mechanical analysis 4.3.6 Testing, testability, and maintainability |
| 20 | 4.3.7 Avionics radiation environment 4.3.8 Management of lead-free termination finish and soldering 4.3.9 Counterfeited, fraudulent and recycled component avoidance |
| 21 | 4.3.10 Moisture and corrosion 4.3.11 Additional customer related application requirements 4.4 Component qualification 4.4.1 General Figures Figure 1 – Suspect components perimeter |
| 22 | 4.4.2 Minimum component qualification requirements 4.4.3 Original component manufacturer quality management 4.4.4 Original component manufacturer process management approval 4.4.5 Demonstration of component qualification |
| 24 | 4.4.6 Qualification of components from a supplier that is not qualified 4.4.7 Distributor process management approval |
| 25 | 4.4.8 Subcontractor assembly facility quality and process management approval 4.5 Continuous component quality assurance 4.5.1 General quality assurance requirements 4.5.2 On-going component quality assurance |
| 26 | 4.5.3 Plan owner in-house continuous monitoring 4.5.4 Component design and manufacturing process change monitoring |
| 27 | 4.6 Component dependability 4.6.1 General 4.6.2 Component availability and associated risk assessment 4.6.3 Component obsolescence |
| 28 | 4.6.4 Proactive measures 4.6.5 Component obsolescence awareness 4.6.6 Reporting 4.6.7 Semiconductor reliability and wear out 4.6.8 Reliability assessment |
| 29 | 4.7 Component compatibility with the equipment manufacturing process 4.8 Component data 4.8.1 General |
| 30 | 4.8.2 Minimum component data requirements 4.9 Configuration control 4.9.1 General |
| 31 | 4.9.2 Alternative components 4.9.3 Alternative sources 4.9.4 Equipment change documentation 4.9.5 Customer notifications and approvals |
| 32 | 4.9.6 Focal organization 5 Plan administration requirements 5.1 Plan organization 5.2 Plan terms and definitions 5.3 Plan focal point 5.3.1 Primary interface 5.3.2 Plan focal point responsibilities 5.4 Plan references 5.5 Plan applicability |
| 33 | 5.6 Plan implementation 5.6.1 ECMP compliance 5.6.2 Plan objectives 5.6.3 Plan owner subcontracted activities 5.7 Plan acceptance 5.8 Plan maintenance |
| 34 | Annex A (informative) Requirement matrix for IEC TS 62239-1 Tables Table A.1 – Requirements matrix |
| 55 | Annex B (informative) Typical qualification requirements and typical component minimum qualification requirements |
| 56 | Table B.1 – Typical qualification requirements and typical component minimum qualification requirements (1 of 3) |
| 59 | Annex C (informative) Semiconductor reliability and wear out |
| 60 | Annex D (informative) Guidelines for environmental protection techniques and for comparison of components specifications Table D.1 – Environmental protection techniques to be considered during the avionics design process |
| 65 | Table D.2 – Guidelines for the comparison of internationally available component specifications – Microcircuitsa |
| 75 | Bibliography |
