BSI PD IEC TS 62565-5-2:2022
$142.49
Nanomanufacturing. Material specifications – Nano-enabled electrodes of electrochemical capacitors. Blank detail specification
Published By | Publication Date | Number of Pages |
BSI | 2022 | 32 |
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
6 | FOREWORD |
8 | INTRODUCTION |
9 | 1 Scope 2 Normative references |
10 | 3 Terms and definitions 3.1 General terms |
11 | 3.2 Terms related to capacitors |
12 | 3.3 General product description and procurement information |
13 | 3.4 Chemical key control characteristics 3.5 Physical key control characteristics |
14 | 3.6 Structural key control characteristics |
15 | 3.7 Electrochemical key control characteristics |
16 | 3.8 Measurement methods relevant for this document |
17 | 4 General introduction regarding measurement methods |
18 | 5 Specification format of nano-enabled electrode of electrochemical capacitor 5.1 General procurement information Tables Table 1 – Format for general product description and procurement information |
19 | 5.2 Chemical key control characteristics 5.3 Physical key control characteristics Table 2 – Format for chemical key control characteristics Table 3 – Format for physical key control characteristics |
20 | 5.4 Structural key control characteristics 5.5 Electrochemical key control characteristics Table 4 – Format for structural key control characteristics Table 5 – Format for electrochemical key control characteristics |
21 | 6 Overview of test methods |
22 | Table 6 – Overview of measurement methods |
24 | Annex A (normative)KCC measurement procedures – supporting information A.1 Water content: Karl Fischer method A.1.1 General A.1.2 Documented measurement procedure A.2 Ash content: Incineration A.2.1 General A.2.2 Documented measurement procedure A.3 Ash content: Thermal gravimetric analysis (TGA) A.3.1 General A.3.2 Documented measurement procedure |
25 | A.4 Magnetic impurities: ICP-MS A.4.1 General A.4.2 Documented measurement procedure A.4.3 Adaptations required A.5 Magnetic impurities: ICP-OES A.5.1 General A.5.2 Documented measurement procedure A.6 Magnetic impurities: ASS A.6.1 General A.6.2 Documented measurement procedure |
26 | A.7 Bending strength: Lacquer cylinder bending tester A.7.1 General A.7.2 Documented measurement procedure A.8 Peel strength A.8.1 General A.8.2 Documented measurement procedure A.9 Rebound rate A.9.1 General A.9.2 Documented measurement procedure A.10 Electrolyte adsorption capacity A.10.1 General |
27 | A.10.2 Documented measurement procedure A.11 Contact angle A.11.1 General A.11.2 Documented measurement procedure A.12 Resistivity A.12.1 General A.12.2 Documented measurement procedure A.12.3 Adaptations required A.13 Thickness A.14 Surface and rolling density A.14.1 General |
28 | A.14.2 Documented measurement procedure A.14.3 Adaptations required A.15 Specific surface area and pore volume A.15.1 General A.15.2 Documented measurement procedure A.16 Surface roughness A.17 Specific capacitance: CCC, CCD A.17.1 General |
29 | A.17.2 Documented measurement procedure A.18 Voltage maintenance rate A.18.1 General A.18.2 Documented measurement procedure A.19 Leakage current: CCC, CCD, CVD A.19.1 General A.19.2 Documented measurement procedure A.20 Endurance in cycling A.20.1 General |
30 | A.20.2 Documented measurement procedure A.21 Temperature endurance A.21.1 General A.21.2 Documented measurement procedure A.22 DC resistance: CCC, CCD A.22.1 General A.22.2 Documented measurement procedure |
31 | Bibliography |