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BSI PD IEC/TS 62647-21:2013

BSI PD IEC/TS 62647-21:2013

$167.15

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Program management. Systems engineering guidelines for managing the transition to lead-free electronics

Published By Publication Date Number of Pages
BSI 2013 38
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This part of IEC 62647 is designed to assist program management and/or systems engineering management in managing the transition to lead -free (Pb-free) electronics to assure product reliability and performance .

Manufacturers of Aerospace, Defence and High Performance (ADHP) electronics may inadvertently introduce Pb -free elements (including piece part finish, printed wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful coordina tion between buyer and supplier is not exercised . For example, piece part manufacturers may not always change part numbers to identify Pb -free finishes, especially if the previous tin -lead (Sn-Pb) finished piece part has been discontinued. Detailed examination of piece parts and documents at receiving inspection , while crucial, may not be sufficient to identify Pb -free piece parts.

NOTE 1 Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by environmental regulations . The industry conversion to Pb -free solder technology may affect an ADHP program in one or both of the following ways:

  • i f the program is required to implement Pb -free technology (contract requirement, environmental regulation, etc), then the program manager/lead systems engineer will need to assess the impact of in -house transition with respect to design (performance of products using Pb -free) and process (processes to build Pb -free products);

  • i f the program purchases COTS ( commercial-off-the-shelf) items for its products/systems, then there is a very good chance that these items will contain Pb -free solder or Pb -free finishes on parts, printed wiring boards (PWBs), printed circuit boards (PCB), or circuit cards assemblies (CCA).

The basic principles delineated in this document can be used for program management and/or systems engineering management of any aerosp ace and/or high performance program . The annexes in the document describe tools that can be used in conjunction with this document.

  • A nnex A describes a matrix of product tier level versus associated risks with respect to a Pb-free transition.

  • A nnex B contains links to the European Union Directives and Executive Order 13148.

  • A nnex C contains a general program manager checklist for dealing with Pb-free issues that summarizes the content of this document.

  • A nnex D contains a general manufacturing process assessment checklist to assess supplier compliance to IEC/TS 62647-1.

  • A nnex E describes a recommended program language to assure performance, reliability, airworthiness, safety, and certifiability of Pb-free product(s).

This document is designed to assist a program in assuring the performance, reliability, airworthiness, safety, and certifiability of product(s), in accordance with IEC/TS 62647-1. Please note that the program manager and systems engineer (along with their respective organizations), and the appropriate enterprise authority work together in ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated accordingly. For the purposes of this document, “p rogram management (or manager) and/or systems engineering management (or manager) and/or the appropriate enterprise authority ” are defined as “program manager ”.

NOTE 2 T he implications are that the program manager and systems engineering manager (along with their respective organizations) and the appropriate enterprise authority work together in ensuring that all impacts of Pb – free technology insertion are understood and risks mitigated accordingly. This document may be used by other high performance and high reliability industries at their discretion.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
9 1 Scope
10 2 Normative references
3 Terms, definitions and abbreviations
3.1 Terms and definitions
13 3.2 Abbreviations
4 General discussion of program management/systems engineering management concerns
4.1 General
14 4.2 Concerns in accordance with IEC/TS 62647-1
4.2.1 General
4.2.2 Reliability
4.2.3 Configuration control
4.2.4 Risk management
4.2.5 Detrimental effects of tin
15 4.2.6 Rework/repair and maintenance
4.3 Additional program management/system engineering management concerns
4.3.1 General
4.3.2 Cost
16 4.3.3 Commercial off-the-shelf
4.3.4 Quality
4.3.5 Contractual language
4.3.6 Program constraints
4.3.7 System engineering management plan
17 5 Requirements definition
5.1 General
5.2 Customer requirements
5.2.1 General
5.2.2 WEEE and RoHS Directives
5.2.3 Executive Order 13148 (green initiative)
5.3 Additional prime contractor requirements
5.4 Change control
6 Use environment(s)
6.1 Impact on use environment(s)
6.2 Impact on storage and transport
18 7 Decision criteria
7.1 Program decision concerning Pb-free
7.2 Compliance to IEC/TS 62647-1
7.3 Solder alloy chosen
7.4 Other programs
7.4.1 General
7.4.2 Percentages of product
7.4.3 Supplier awareness
8 Supplier’s lead-free control plan
8.1 General
19 8.2 Supplier procurement and sub-contractor control
8.2.1 General
8.2.2 Supplier procurement
8.2.3 Supplier sub-contractor control plan
20 8.3 Productibility plan
8.4 Manufacturing changes
8.5 Manufacturing risk management
8.6 Supplier schedule of Pb-free implementation
9 Requalification/test plan
9.1 General
9.2 Delta qualification or requalification
9.3 Acceptance by analysis/test
21 9.4 Acceptance by similarity
10 Rework/repair and maintenance
10.1 General
10.2 Supplier recommendations for rework/repair of Pb-free products
10.3 Maintenance and training documentation
11 Risk management
11.1 General
11.2 Program-level identification of program-level risks
11.3 Risk analyses
11.4 Risk mitigation
12 Cost
22 13 Presentation to customer
13.1 General
13.2 Compliance to IEC/TS 62647-1
13.3 System engineering management plan
13.4 Other deliverables to the customer
23 Annex A (informative) Matrix of tier level versus associated risk
25 Annex B (informative) Links to the European Union Directives and Executive Order 13148
26 Annex C (informative) General program manager checklist for dealing with Pb-free issues
28 Annex D (informative) General manufacturing process assessment checklist for assessing supplier compliance to IEC/TS 62647-1
35 Annex E (informative) Recommended program language (subject to contractual agreements)
36 Bibliography

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