BSI PD IEC/TS 62686-1:2015
$198.66
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications – General requirements for high reliability integrated circuits and discrete semiconductors
| Published By | Publication Date | Number of Pages |
| BSI | 2015 | 68 |
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose “off the shelf” COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications.
This Technical Specification applies to all components that can be operated in ADHP applications within the manufacturers’ publicly available data sheet limits in conjunction with IEC TS 62239-1. It may be used by other high performance and high reliability industries, at their discretion.
ADHP application requirements may not necessarily be fulfilled by this specification alone. ADHP OEMs (original equipment manufacturers) may need to consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their IEC TS 62239-1 ECMP procedures. Alternatively a component in accordance with IEC TS 62564-1 may be more suitable.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references |
| 12 | 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
| 14 | 3.2 Abbreviations |
| 16 | 4 Technical requirements 4.1 General 4.2 Procedures 4.2.1 General 4.2.2 Product discontinuance 4.2.3 ESD protection during manufacture |
| 17 | 4.2.4 Specification control 4.2.5 Traceability including anti-counterfeit measures 4.3 Product or process change notification (PCN) 4.3.1 General 4.3.2 Notification 4.3.3 Notification details |
| 18 | 4.3.4 Notifiable changes 4.4 Shipment controls 4.4.1 General 4.4.2 Shipping container and date code marking 4.4.3 Date code remarking 4.4.4 Inner container formation |
| 19 | 4.4.5 Date code age on delivery 4.4.6 ESD marking 4.4.7 MSL 4.4.8 Lead-free marking 4.4.9 Labels |
| 20 | 4.5 Electrical 4.5.1 General 4.5.2 Electrical test 4.5.3 Electrical parameter assessment 4.5.4 SDRAM memories Tables Table 1 – Label requirements |
| 21 | 4.5.5 Logic families 4.5.6 Power MOSFETs 4.5.7 Silicon rectifier diodes 4.6 Mechanical 4.6.1 General 4.6.2 Device marking 4.6.3 Small packages 4.6.4 Moisture sensitivity 4.6.5 Robustness of hermetic seals |
| 22 | 4.6.6 Termination finishes 4.7 Audit capability 4.7.1 General 4.7.2 Internal quality audits 4.7.3 Subcontract manufacturing Table 2 – Internal quality audit requirements |
| 23 | 4.8 Quality assurance 4.8.1 General 4.8.2 Quality system 4.8.3 Sampling plans 4.8.4 Failure analysis support 4.8.5 Outgoing quality |
| 24 | 4.9 Supplier performance monitoring by the user 4.9.1 General 4.9.2 Lot acceptance Table 3 – Outgoing quality |
| 25 | 4.9.3 Suspension of deliveries 4.9.4 Loss of approval 4.9.5 AQL figures 4.9.6 100 % screening 4.9.7 Termination determination 4.10 Qualification 4.10.1 General Table 4 – Incoming test |
| 26 | 4.10.2 Methodology |
| 27 | 4.10.3 Test samples |
| 28 | 4.10.4 Qualification categories 4.10.5 Maintenance of qualification standard 4.10.6 In-process test results |
| 29 | Table 5 – Technology/family qualification and device qualification (1 of 3) |
| 32 | 4.10.7 Product monitor results 4.10.8 References 4.10.9 Qualification report 4.10.10 Archiving 4.10.11 Qualification by similarity 4.10.12 Similarity assessment |
| 33 | 4.11 Reliability 4.11.1 General 4.11.2 Operating reliability 4.11.3 Failure criteria |
| 34 | 4.11.4 Corrective action 4.11.5 Warranty 4.11.6 Suspension of certification 4.11.7 Single event effects (SEE) 4.12 Product monitor 4.12.1 General 4.12.2 Monitor programme |
| 35 | 4.12.3 Problem notification 4.12.4 Data reporting 4.12.5 Samples 4.12.6 Corrective action 4.12.7 Product monitor results 4.12.8 Accumulated test data |
| 36 | 4.13 Environmental, health and safety (EHS) 4.13.1 General 4.13.2 EHS compliance 4.13.3 Device handling 4.13.4 Device materials 4.14 Shipping containers 4.14.1 General 4.14.2 ESD requirements Table 6 – Product monitor tests |
| 38 | 4.14.3 Magazine reuse 4.14.4 Tubes 4.14.5 Trays |
| 39 | 4.14.6 Tape and reel 4.15 Compliance with internal standards |
| 40 | Annex A (informative) Test code (TC) information A.1 General A.2 TC1 – Autoclave (AC) A.3 TC2 – Bond strength, internal (BS) A.4 TC3 – Die shear strength (DS) A.5 TC4 – Electromigration (EM) |
| 41 | A.6 TC5 – Electrostatic discharge (ESD) A.7 TC6 – Electrical test (ET) A.8 TC7 – Electrical distributions (ED) |
| 42 | A.9 TC8 – Flammability (FL) A.10 TC9 – Hot carrier injection (HCI) A.11 TC10 – Hermeticity (HE) A.12 TC11 – High temperature bake (HTB) Table A.1 – Conditions of the DC over voltage stress methodof JP001.01 or IEC 62416 test |
| 43 | A.13 TC12 – High temperature blocking bias (HTBB) A.14 TC13 – High temperature gate bias (HTGB) A.15 TC14 – High temperature reverse bias (HTRB) A.16 TC15 – High temperature operating life (HTOL) A.16.1 General A.16.2 Qualification conditions A.16.3 Test results assessment |
| 44 | A.16.4 Temperature acceleration factor A.16.5 Supply voltage acceleration factor Table A.2 – Examples of temperature acceleration factors |
| 45 | A.17 TC16 – Latch-up (LU) A.18 TC17 – Lead integrity (LI) A.19 TC18 – Lid torque (LT) A.20 TC19 – Mechanical sequence (MS) A.20.1 General |
| 46 | A.20.2 Constant acceleration A.20.3 Vibration (variable frequency) A.20.4 Mechanical shock A.21 TC20 – Marking permanency (MP) A.22 TC21 – Non-volatile memory operating life (NVL) |
| 47 | A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI) A.24 TC23 – Package dimensions (PD) A.25 TC24 – Power cycling (PTC) A.26 TC25 – Resistance to solder heat (RSH) A.27 TC26 – Solder preconditioning (PC) |
| 48 | A.28 TC27 – Solderability (SD) A.29 TC28 – Soft error rate (SER) Table A.3 – Dip and look test references Table A.4 – Parameter values for consideration |
| 49 | A.30 TC29 – Steady state operating life (SSOL) A.31 TC30 – Temperature cycling (TC) A.32 TC31 – Temperature humidity reverse bias (THRB) Table A.5 – Test conditions |
| 50 | A.33 TC32 – Temperature humidity bias (THB or HAST) A.34 TC33 – Terminal strength (TS) A.35 TC34 – Thermal resistance (thermal impedance) (TR) A.36 TC35 – visual inspection (VI) A.36.1 TC35a – External visual inspection Table A.6 – Test methods |
| 51 | A.36.2 TC35b – Internal visual inspection A.37 TC36 – Water vapour content, internal (WV) |
| 52 | A.38 TC37 – Xray inspection (XR) A.39 TC38 – Moisture sensitivity level (MSL) A.40 TC39 – Ball shear test (BST) A.41 TC40 – Negative bias temperature instability (NBTI) A.42 TC41 – Accelerated tin whisker test |
| 53 | Annex B (informative) Cross-reference to STACK Specification S/0001 revision 14 |
| 60 | Bibliography |
