BSI PD IEC TS 62686-1:2020
$215.11
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications – General requirements for high reliability integrated circuits and discrete semiconductors
| Published By | Publication Date | Number of Pages |
| BSI | 2020 | 86 |
This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose “off the shelf” COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications.
This document applies to all components that can be operated in ADHP applications within the manufacturers’ publicly available data sheet limits in conjunction with IEC 62239-1. It can be used by other high performance and high reliability industries, at their discretion.
ADHP application requirements are not necessarily fulfilled by this document alone. ADHP OEMs (original equipment manufacturers) might need to consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their IEC 62239-1 ECMP procedures. Alternatively, a component in accordance with IEC TS 62564-1 can be more suitable.
NOTE Component qualification and outgoing quality discussed herein do not addres component atmospheric radations SEE effects per IEC 62396-1.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references |
| 12 | 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions |
| 14 | 3.2 Abbreviated terms |
| 16 | 4 Technical requirements 4.1 General 4.1.1 Overview |
| 17 | 4.1.2 Automotive components 4.2 Procedures 4.2.1 General 4.2.2 Product discontinuance 4.2.3 ESD protection during manufacture |
| 18 | 4.2.4 Specification control 4.2.5 Traceability including anti-counterfeit measures 4.3 Product or process change notification (PCN) 4.3.1 General 4.3.2 Notification 4.3.3 Notification details |
| 19 | 4.3.4 Notifiable changes 4.4 Shipment controls 4.4.1 General 4.4.2 Shipping container and date code marking 4.4.3 Date code remarking 4.4.4 Inner container formation |
| 20 | 4.4.5 Date code age on delivery 4.4.6 ESD marking 4.4.7 MSL 4.4.8 Lead-free marking 4.4.9 Labels |
| 21 | 4.5 Electrical 4.5.1 General 4.5.2 Electrical test 4.5.3 Electrical parameter assessment Tables Table 1 – Label requirements |
| 22 | 4.5.4 SDRAM memories 4.5.5 Logic families 4.5.6 Power MOSFETs 4.5.7 Silicon rectifier diodes 4.6 Mechanical 4.6.1 General 4.6.2 Device marking 4.6.3 Small packages 4.6.4 Moisture sensitivity |
| 23 | 4.6.5 Robustness of hermetic seals 4.6.6 Termination finishes 4.7 Audit capability 4.7.1 General 4.7.2 Internal quality audits Table 2 – Internal quality audit requirements |
| 24 | 4.7.3 Subcontract manufacturing 4.8 Quality assurance 4.8.1 General 4.8.2 Quality system 4.8.3 Sampling plans 4.8.4 Failure analysis support 4.8.5 Outgoing quality |
| 25 | 4.9 Qualification 4.9.1 General Table 3 – Outgoing quality |
| 26 | 4.9.2 Methodology |
| 27 | 4.9.3 Test samples |
| 28 | 4.9.4 Qualification categories 4.9.5 Maintenance of qualification standards 4.9.6 In-process test results |
| 29 | Table 4 – Technology/family qualification and device qualification (1 of 3) |
| 32 | 4.9.7 Product monitor results 4.9.8 References 4.9.9 Qualification report 4.9.10 Archiving 4.9.11 Qualification by similarity 4.9.12 Similarity assessment |
| 33 | 4.10 Reliability 4.10.1 General 4.10.2 Operating reliability 4.10.3 Failure criteria |
| 34 | 4.10.4 Corrective action 4.10.5 Warranty 4.10.6 Single event effects (SEEs) 4.11 Product monitor 4.11.1 General 4.11.2 Monitor programme 4.11.3 Problem notification |
| 35 | 4.11.4 Data reporting 4.11.5 Samples 4.11.6 Corrective action 4.11.7 Product monitor results 4.11.8 Accumulated test data |
| 36 | 4.12 Environmental health and safety (EHS) 4.12.1 General 4.12.2 EHS compliance 4.12.3 Device handling 4.12.4 Device materials 4.13 Shipping containers 4.13.1 General 4.13.2 ESD requirements Table 5 – Product monitor tests |
| 38 | 4.13.3 Magazine reuse 4.13.4 Tubes 4.13.5 Trays |
| 39 | 4.13.6 Tape and reel 4.14 Compliance with internal standards |
| 40 | Annex A (informative) Test code (TC) information A.1 General A.2 TC1 – Autoclave (ATC) A.3 TC2 – Bond strength, internal (BS) A.4 TC3 – Die shear strength (DS) A.5 TC4 – Electromigration (EM) |
| 41 | A.6 TC5 – Electrostatic discharge (ESD) A.7 TC6 – Electrical test (ET) A.8 TC7 – Electrical distributions (EDs) |
| 42 | A.9 TC8 – Flammability (FL) A.10 TC9 – Hot carrier injection (HCI) A.11 TC10 – Hermeticity (HE) A.12 TC11 – High temperature bake (HTB) Table A.1 – Conditions of the DC over the voltage stress methodof JP001.01 or IEC 62416 test |
| 43 | A.13 TC12 – High temperature blocking bias (HTBB) A.14 TC13 – High temperature gate bias (HTGB) A.15 TC14 – High temperature reverse bias (HTRB) A.16 TC15 – High temperature operating life (HTOL) A.16.1 General A.16.2 Qualification conditions |
| 44 | A.16.3 Test results assessment A.16.4 Temperature acceleration factor Table A.2 – Examples of temperature acceleration factors |
| 45 | A.16.5 Supply voltage acceleration factor A.17 TC16 – Latch-up (LU) A.18 TC17 – Lead integrity (LI) A.19 TC18 – Lid torque (LT) A.20 TC19 – Mechanical sequence (MS) A.20.1 General |
| 46 | A.20.2 Constant acceleration A.20.3 Vibration (variable frequency) A.20.4 Mechanical shock A.21 TC20 – Marking permanency (MP) A.22 TC21 – Non-volatile memory operating life (NVL) |
| 47 | A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI) A.24 TC23 – Package dimensions (PD) A.25 TC24 – Power cycling (PTC) A.26 TC25 – Resistance to solder heat (RSH) |
| 48 | A.27 TC26 – Solder preconditioning (PC) A.28 TC27 – Solderability (SD) A.29 TC28 – Soft error rate (SER) Table A.3 – Dip and look test references |
| 49 | A.30 TC29 – Steady state operating life (SSOL) A.31 TC30 – Temperature cycling (TPC) Table A.4 – Parameter values for consideration Table A.5 – Test conditions |
| 50 | A.32 TC31 – Temperature humidity reverse bias (THRB) A.33 TC32 – Temperature humidity bias (THB or HAST) A.34 TC33 – Terminal strength (TS) A.35 TC34 – Thermal resistance (thermal impedance) (TR) Table A.6 – Test methods |
| 51 | A.36 TC35 – Visual inspection (VI) A.36.1 TC35a – External visual inspection A.36.2 TC35b – Internal visual inspection |
| 52 | A.37 TC36 – Water vapour content, internal (WV) A.38 TC37 – Xray inspection (XR) A.39 TC38 – Moisture sensitivity level (MSL) A.40 TC39 – Ball shear test (BST) A.41 TC40 – Negative bias temperature instability (NBTI) |
| 53 | A.42 TC41 – Accelerated tin whisker test |
| 54 | Annex B (informative) Typical automotive component requirements |
| 56 | Annex C (informative) Requirement matrix for IEC TS 62686-1 verification Table C.1 – Requirement matrix |
| 80 | Bibliography |
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BSI PD IEC TS 62686-1:2020
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