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BSI PD IEC TS 62686-1:2020

BSI PD IEC TS 62686-1:2020

$215.11

Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications – General requirements for high reliability integrated circuits and discrete semiconductors

Published By Publication Date Number of Pages
BSI 2020 86
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This part of IEC 62686, which is a Technical Specification, defines the minimum requirements for general purpose “off the shelf” COTS (commercial off-the-shelf) integrated circuits and discrete semiconductors for ADHP (aerospace, defence and high performance) applications.

This document applies to all components that can be operated in ADHP applications within the manufacturers’ publicly available data sheet limits in conjunction with IEC 62239-1. It can be used by other high performance and high reliability industries, at their discretion.

ADHP application requirements are not necessarily fulfilled by this document alone. ADHP OEMs (original equipment manufacturers) might need to consider redesigning their products or conducting further testing to verify suitability in ADHP applications using their IEC 62239-1 ECMP procedures. Alternatively, a component in accordance with IEC TS 62564-1 can be more suitable.

NOTE Component qualification and outgoing quality discussed herein do not addres component atmospheric radations SEE effects per IEC 62396-1.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
8 FOREWORD
10 INTRODUCTION
11 1 Scope
2 Normative references
12 3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
14 3.2 Abbreviated terms
16 4 Technical requirements
4.1 General
4.1.1 Overview
17 4.1.2 Automotive components
4.2 Procedures
4.2.1 General
4.2.2 Product discontinuance
4.2.3 ESD protection during manufacture
18 4.2.4 Specification control
4.2.5 Traceability including anti-counterfeit measures
4.3 Product or process change notification (PCN)
4.3.1 General
4.3.2 Notification
4.3.3 Notification details
19 4.3.4 Notifiable changes
4.4 Shipment controls
4.4.1 General
4.4.2 Shipping container and date code marking
4.4.3 Date code remarking
4.4.4 Inner container formation
20 4.4.5 Date code age on delivery
4.4.6 ESD marking
4.4.7 MSL
4.4.8 Lead-free marking
4.4.9 Labels
21 4.5 Electrical
4.5.1 General
4.5.2 Electrical test
4.5.3 Electrical parameter assessment
Tables
Table 1 – Label requirements
22 4.5.4 SDRAM memories
4.5.5 Logic families
4.5.6 Power MOSFETs
4.5.7 Silicon rectifier diodes
4.6 Mechanical
4.6.1 General
4.6.2 Device marking
4.6.3 Small packages
4.6.4 Moisture sensitivity
23 4.6.5 Robustness of hermetic seals
4.6.6 Termination finishes
4.7 Audit capability
4.7.1 General
4.7.2 Internal quality audits
Table 2 – Internal quality audit requirements
24 4.7.3 Subcontract manufacturing
4.8 Quality assurance
4.8.1 General
4.8.2 Quality system
4.8.3 Sampling plans
4.8.4 Failure analysis support
4.8.5 Outgoing quality
25 4.9 Qualification
4.9.1 General
Table 3 – Outgoing quality
26 4.9.2 Methodology
27 4.9.3 Test samples
28 4.9.4 Qualification categories
4.9.5 Maintenance of qualification standards
4.9.6 In-process test results
29 Table 4 – Technology/family qualification and device qualification (1 of 3)
32 4.9.7 Product monitor results
4.9.8 References
4.9.9 Qualification report
4.9.10 Archiving
4.9.11 Qualification by similarity
4.9.12 Similarity assessment
33 4.10 Reliability
4.10.1 General
4.10.2 Operating reliability
4.10.3 Failure criteria
34 4.10.4 Corrective action
4.10.5 Warranty
4.10.6 Single event effects (SEEs)
4.11 Product monitor
4.11.1 General
4.11.2 Monitor programme
4.11.3 Problem notification
35 4.11.4 Data reporting
4.11.5 Samples
4.11.6 Corrective action
4.11.7 Product monitor results
4.11.8 Accumulated test data
36 4.12 Environmental health and safety (EHS)
4.12.1 General
4.12.2 EHS compliance
4.12.3 Device handling
4.12.4 Device materials
4.13 Shipping containers
4.13.1 General
4.13.2 ESD requirements
Table 5 – Product monitor tests
38 4.13.3 Magazine reuse
4.13.4 Tubes
4.13.5 Trays
39 4.13.6 Tape and reel
4.14 Compliance with internal standards
40 Annex A (informative) Test code (TC) information
A.1 General
A.2 TC1 – Autoclave (ATC)
A.3 TC2 – Bond strength, internal (BS)
A.4 TC3 – Die shear strength (DS)
A.5 TC4 – Electromigration (EM)
41 A.6 TC5 – Electrostatic discharge (ESD)
A.7 TC6 – Electrical test (ET)
A.8 TC7 – Electrical distributions (EDs)
42 A.9 TC8 – Flammability (FL)
A.10 TC9 – Hot carrier injection (HCI)
A.11 TC10 – Hermeticity (HE)
A.12 TC11 – High temperature bake (HTB)
Table A.1 – Conditions of the DC over the voltage stress methodof JP001.01 or IEC 62416 test
43 A.13 TC12 – High temperature blocking bias (HTBB)
A.14 TC13 – High temperature gate bias (HTGB)
A.15 TC14 – High temperature reverse bias (HTRB)
A.16 TC15 – High temperature operating life (HTOL)
A.16.1 General
A.16.2 Qualification conditions
44 A.16.3 Test results assessment
A.16.4 Temperature acceleration factor
Table A.2 – Examples of temperature acceleration factors
45 A.16.5 Supply voltage acceleration factor
A.17 TC16 – Latch-up (LU)
A.18 TC17 – Lead integrity (LI)
A.19 TC18 – Lid torque (LT)
A.20 TC19 – Mechanical sequence (MS)
A.20.1 General
46 A.20.2 Constant acceleration
A.20.3 Vibration (variable frequency)
A.20.4 Mechanical shock
A.21 TC20 – Marking permanency (MP)
A.22 TC21 – Non-volatile memory operating life (NVL)
47 A.23 TC22 – Time dependent dielectric breakdown (oxide integrity) (OI)
A.24 TC23 – Package dimensions (PD)
A.25 TC24 – Power cycling (PTC)
A.26 TC25 – Resistance to solder heat (RSH)
48 A.27 TC26 – Solder preconditioning (PC)
A.28 TC27 – Solderability (SD)
A.29 TC28 – Soft error rate (SER)
Table A.3 – Dip and look test references
49 A.30 TC29 – Steady state operating life (SSOL)
A.31 TC30 – Temperature cycling (TPC)
Table A.4 – Parameter values for consideration
Table A.5 – Test conditions
50 A.32 TC31 – Temperature humidity reverse bias (THRB)
A.33 TC32 – Temperature humidity bias (THB or HAST)
A.34 TC33 – Terminal strength (TS)
A.35 TC34 – Thermal resistance (thermal impedance) (TR)
Table A.6 – Test methods
51 A.36 TC35 – Visual inspection (VI)
A.36.1 TC35a – External visual inspection
A.36.2 TC35b – Internal visual inspection
52 A.37 TC36 – Water vapour content, internal (WV)
A.38 TC37 – Xray inspection (XR)
A.39 TC38 – Moisture sensitivity level (MSL)
A.40 TC39 – Ball shear test (BST)
A.41 TC40 – Negative bias temperature instability (NBTI)
53 A.42 TC41 – Accelerated tin whisker test
54 Annex B (informative) Typical automotive component requirements
56 Annex C (informative) Requirement matrix for IEC TS 62686-1 verification
Table C.1 – Requirement matrix
80 Bibliography

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BSI PD IEC TS 62686-1:2020
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