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EIA/ECCB-952-2004

$23.40

Standard for Plans to Determine Lead Content of Electronic Components and Related Equipment

Published By Publication Date Number of Pages
ECIA 2004 16
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This document defines the requirements for documenting processes
to assure customers and users of given products or sets of
products, that their lead content is known. This document does not
contain detailed descriptions of the processes to be documented,
but lists high-level requirements for such processes, and areas of
concern to the users and customers that must be addressed by the
processes. The detailed information may be obtained from other
sources, including the references of this document.

Purpose of this document

This document is intended for use by:

(1) manufacturers, suppliers, repairers, and maintainers of
products to develop methods to test, analyze, or otherwise
ascertain the lead content of the products they manufacture or
supply; and

(2) customers and users of those products to know, on a
quantitative basis, the lead content of the products, and to
understand the method(s) by which it was determined.

This document describes the required elements of a Plan for
assessing the lead content of a product, or set of products. The
Plan owner is the manufacturer, supplier, repairer, or maintainer
of the products. The Plan documents, in an organized manner, the
baseline processes that the Plan owner uses to assess, with
quantitative results, the lead content of the product, or set of
products, It is expected that:

(a) the Plan will be a high-level reference to the processes
used, but that the actual processes

(b) the Plan will be a baseline document that addresses the
majority of issues associated with will be documented separately;
and the Plan owner's use of lead-free solder, and will be
tailorable to address programspecific issues.

EIA/ECCB-952-2004
$23.40