IEC 60749-14:2003
$22.75
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques – Partie 14 : robustesse de sorties (intégrité des connexions)
| Published By | Publication Date | Number of Pages |
| IEC | 2003-08-07 | 36 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2003-08-07 |
| Pages Count | 36 |
| Language | France |
| Edition | 1.0 |
| File Size | 542.7 KB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
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