IEC 61249-8-8:1997
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Materials for interconnection structures – Part 8: Sectional specification set for non-conductive films and coatings – Section 8: Temporary polymer coatings
| Published By | Publication Date | Number of Pages |
| IEC | 1997-06-24 | 32 |
Provides requirements for the qualification of temporary solder resist coatings.
Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
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