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IEC 62878-1:2019

IEC 62878-1:2019

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Device embedding assembly technology – Part 1: Generic specification for device embedded substrates

Published By Publication Date Number of Pages
IEC 2019-10-14 42
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IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

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IEC 62878-1:2019
$33.15