IEC 63055:2016

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Format for LSI-Package-Board Interoperable design

Published By	Publication Date	Number of Pages
IEC	2016-11-08	208

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Categories: 31.180 - Printed circuits and boards, 31.200 - Integrated circuits. Microelectronics, 35.060 - Languages used in information technology, IEC

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Description

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2016-11-08
Pages Count	208
Language	English
Edition	1.0
File Size	8.3 MB
ICS Codes	31.180 - Printed circuits and boards 31.200 - Integrated circuits. Microelectronics 35.060 - Languages used in information technology

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IEC 63055:2016

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