IEC TR 60286-7:2019

$22.75

Packaging of components for automatic handling – Part 7: Introduction of a bulk blister pack for miniaturized components

Published By	Publication Date	Number of Pages
IEC	2019-10-14	28

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Categories: 31.020 - Electronic components in general, 31.240 - Mechanical structures for electronic equipment, IEC

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Description

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2019-10-14
Pages Count	28
Language	France
Edition	1.0
File Size	3.0 MB
ICS Codes	31.020 - Electronic components in general 31.240 - Mechanical structures for electronic equipment