IEC TR 62878-2-7:2019
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Device embedding assembly technology – Part 2-7: Guidelines – Accelerated stress testing of passive embedded circuit boards
| Published By | Publication Date | Number of Pages |
| IEC | 2019-03-20 | 16 |
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
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