IEEE 1301.2 1993
$57.08
IEEE Recommended Practices for the Implementation of a Metric Equipment Practice (IEEE Std 1301-1991)
| Published By | Publication Date | Number of Pages |
| IEEE | 1993 | 29 |
New IEEE Standard – Inactive – Withdrawn. Administratively withdrawn January 2007 Recommendations provide guidance in the implementation of the generic standard, IEEE Std 1301-1991, and the connector-related standards, such as IEEE Std 1301.1-1991 and IEEE Std 1301.3-1992. This recommended practice may be applied in all fields of electronics where equipment and installations are required to conform to a metric modular order. The IEEE 1301 metric equipment practices are in accordance with IEC 917 (1988) and IEC 917-0 (1989), including cabinet, rack, subracks, printed boards, and common connector-dependent dimensions for connector pitches of 2.5, 2.0, 1.5, 1.0, and 0.5 mm.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Title Page |
| 3 | Introduction Participants |
| 5 | CONTENTS |
| 7 | 1. Overview 1.1 Scope and purpose 1.2 Background |
| 8 | 1.3 Implementation 1.4 Dimensions |
| 9 | 1.5 Coordination dimensions 1.6 Connector-related parameters 1.7 Environmental requirements |
| 10 | 2. References |
| 11 | 3. Special word usage, definitions, and abbreviations 3.1 Special word usage 3.2 Definitions 3.3 Abbreviations |
| 12 | 4. Dimensional nomenclature 5. Interoperability 5.1 Overall cabinet and rack sizes 5.2 Mounting an IEC 297-3 (or IEEE 1101.1) subrack, rack, or cabinet panel in an IEEE 1301 cabinet or rack, and the reverse |
| 15 | 5.3 Subracks |
| 18 | 5.4 Plug-in units |
| 19 | 6. Cabinets and racks 6.1 Cabinet or rack |
| 21 | 6.2 Rack and cabinet front panels 7. Subracks 7.1 Subrack size selection 7.2 Printed board guide |
| 22 | 7.3 Front panel 7.4 Thermal management considerations 8. Backplane 8.1 Height 8.2 Width |
| 23 | 8.3 Thickness 8.4 Bow allowance 8.5 Stiffeners 8.6 Plug-in unit size or pitch 8.7 Power distribution requirements 8.8 Backplane connector requirements 9. Plug-in unit 9.1 Plug-in unit requirements |
| 24 | 9.2 Printed board 9.3 Front panel attachment option 9.4 Indicators and switches |
| 25 | 9.5 Alignment pin 10. Connector requirements 10.1 Connector type/pin pitch 10.2 Backplane connectors 10.3 Plug-in unit connectors (used only with box- or frame-type plug-in units) 10.4 Printed board connectors 10.5 Front mounted l/O connectors 11. Specific example 11.1 Overview |
| 26 | 11.2 Profile B market segment 11.3 Equipment practice 11.4 Plug-in unit size considerations 11.5 Plug-in unit pitch and I/O direction |
| 27 | 11.6 Plug-in unit printed board thickness 11.7 Allowance for components on side 2 of the printed board 11.8 Plug-in unit ESD protection 11.9 Plug-in unit guide groove width definition 11.10 Front panel and VDE/FCC considerations 11.11 Backplane to plug-in unit connector choice |
| 29 | 11.12 Tolerance and alignment requirements 11.13 Thermal considerations 11.14 Safety considerations |
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