IEEE 896.2 1992
$81.79
IEEE Standard Backplane Bus Specification for Multiprocessor Architectures: Futurebus+(R)
Published By | Publication Date | Number of Pages |
IEEE | 1992 | 222 |
New IEEE Standard – Inactive – Withdrawn. Futurebus+ standards provide systems developers a set of tools with which high-performance bus-based systems may be developed. This architecture provides a wide range of performance scalability over both cost and time for multiple generations of single- and multiple-bus multiprocessor systems. This document, a companion standard to IEEE Std. 896.1-1991, builds on the logical layer by adding requirements for physical layer instantiation. Material in this document includes specifications for node management, live insertion, and profiles. It is to these profiles that products will claim conformance. Other specifications that may be required in conjunction with this standard are the following: IEEE Std 896.1-1991; P896.3, Futurebus+ Recommended Practices; P1212.x, Control and Status Register Architectures; IEEE Std 1194.1-1991, Electrical Characteristics of Backplane Transceiver Logic (BTL) Interface Circuits; and IEEE Std 1301.x, Metric Equipment Practices for Microcomputers.
PDF Catalog
PDF Pages | PDF Title |
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5 | U BOU N D-H |
7 | I BIT FIELD I REQ I ACCESS IPOWER-UP1 SYSTEM I BUS |
16 | Table |
17 | In tr o ducti on 1.1 Scope Fig |
18 | 1.2 References 1.2.1 Protocol Stack Specifications Control Fig |
19 | Definitions and Structure 2.1 Special Word Usage |
20 | 2.2 Definitions |
24 | 2.3 Signal Conventions 2.4 Numbering Conventions Signal Conventions |
25 | 2.5 Futurebus+ Logo Numbering Conventions IEEE 896 Logo |
26 | Address Space 3.1.1.1 Memory Addresses |
27 | Futurebus+ Boards Modules and Nodes 32-bit CSR Addressing |
28 | 3.1.1.3 Hybrid Addressing 32-bit CSR Addressing First CSR Address of Local Bus Node One |
29 | Byte Lane Mapping Hybrid Addressing |
30 | Base Functional Character Native Big Endian Node to Futurebus+ CSR Byte Lane Mapping Native Little Endian Node to Futurebus+ CSR Byte Lane Mapping |
31 | 3.1.2.1 Resets 3.1.2.2 ROM Identification Reset (RE*) Operations Basic Node ROM Structure |
32 | 3.1.2.3 Capability and Setup 3.1.2.4 Bus Control |
33 | 3.1.2.5 Distributed Arbitration Timeout and Setup |
34 | 3.1.2.7 Retry Node State Control |
35 | 3.1.2.9 Standard Diagnostic Interface Table |
36 | Table |
37 | Optional Functional Character 3.1.3.1 Messages |
38 | 3.1.3.2 Arbitrated Messages |
39 | 3.1.3.3 Interrupts Comparison of Interrupt Registers |
40 | 3.1.3.4 Packet Management 3.1.3.5 Clock Synchronization |
44 | 3.1.3.6 Unit Access |
45 | Clock Synchronization |
46 | Futurebus+ CSR Specification 3.2.1 CSR Memory Space Specification |
47 | 3.2.2 Core CSRs CSR Address Space Allocation |
48 | STATE-CLEAR and STATE-SET CSRs Core CSRs and Addresses |
49 | STATE-CLEAR and STATE-SET CSR Bit Descriptions |
50 | 3.2.2.2 NODE-IDS CSR Fields in the STATE-CLEAR and STATE-SET CSRs Used by Futurebus+ NODE-IDS CSR Bit Descriptions |
51 | 3.2.2.3 RESET-START CSR Format of the NODE-IDS CSR |
52 | Internal Indirect Address Space CSRs Format of the RESET-START CSR Format of the Internal INDIRECT-ADDRESS CSR Internal INDIRECT-ADDRESS CSR Bit Description |
53 | 3.2.2.5 SPLIT-TIMEOUT CSR Format of the Internal INDIRECT-DATA CSR Internal INDIRECT-DATA CSR Bit Description SPLIT-TIMEOUT CSR Bit Description |
54 | Format of the SPLIT-TIMEOUT CSRs ARGUMENT CSRs Bit Description |
55 | 3.2.2.7 TEST-START CSR Fig 14 (a) General Format of the ARGUMENT CSRs Extended Test Category Format of the Argument CSRs |
56 | TEST-START CSR Bit Descriptions |
57 | Format of the TEST-START CSR |
58 | TEST-STATUS CSR Bit Descriptions |
60 | Extended Units Address Space CSRs Format of the TEST-STATUS CSR |
61 | Format of the UNITS-BASE CSR Format of the UNITS-BOUND CSR UNITS-BASE CSR Bit Description UNITS-BOUND CSR Bit Description |
62 | Memory Unit Address Space CSRs Format of the MEMORY-BASE CSR MEMORY-BASE CSR Bit Description |
63 | INTERRUPT-TARGET and INTERRUPT-MASK CSRs Format of the MEMORY-BOUND CSR MEMORY-BOUND CSR Bit Description INTERRUPT-TARGET CSR Bit Description |
64 | CSRs for Clock Synchronization INTERRUPT-MASK CSR Bit Description CLOCK-VALUE CSR Bit Description |
65 | CLOCK-TICK-PERIOD CSR Bit Description CLOCK-STROBE-ARRIVED CSR Bit Description |
67 | Message Target CSRs 3.2.2.14 Error Symptom CSRs CLOCK-REFERENCE CSR Bit Description MESSAGE-REQUEST CSR Bit Description MESSAGE-RESPONSE CSR Bit Description |
68 | ERROR-HI CSR Bit Descriptions |
70 | ERROR-HI CSR Format (Most Significant Half) ERROR-HI CSR Format (Least Significant Half) |
71 | ERROR-LO CSR Bit Descriptions |
72 | Format of the ERROR-LO CSR |
73 | FAILING-ADDRESS CSR BYTE-LANE-IN-ERROR CSR DATA-HOLD CSR TAG-HOLD CSR |
74 | Futurebus+ Dependent CSR Area Fig 24 Format of the TAG-HOLD Register TIME-STAMP CSR |
75 | 3.2.3.1 LOGICAL-COMMON-CONTROL CSR Futurebus+ Specific CSRs LOGICAL-COMMON-CONTROL CSR Bit Descriptions |
76 | Format of the LOGICAL-COMMON-CONTROL CSR |
77 | 3.2.3.2 LOGICAL-MODULE-CONTROL CSR LOGICAL-MODULE-CONTROL CSR Bit Descriptions |
79 | 3.2.3.3 BUS-PROPAGATION-DELAY CSR Format ofthe LOGICAL-MODULE-CONTROL CSR |
80 | 3.2.3.4 COMPETITION-SETTLING-TIME CSR BUS-PROPAGATION-DELAY CSR Bit Descriptions Table 39 COMPETITION-SETTLING-TIME CSR Bit Descriptions |
81 | 3.2.3.6 MESSAGE-PASSING-SELECT-MASK CSR Busy Retry CSRs MESSAGE-PASSING-SELECT-MASK CSR Bit Descriptions Table |
82 | Fig 27 BUSY-RETRY-COUNTER CSR BUSY-RETRY-COUNTER CSR Bit Descriptions Table |
83 | Error Retry CSRs BUSY-RETRY-DELAY CSR |
84 | ERROR-RETRY-COUNTER CSR ERROR-RETRY-COUNTER CSR Bit Descriptions Table ERROR-RETRY-DELAY CSR Bit Descriptions Table |
85 | Bus Specific ROM Entries ERROR-RETRY-DELAY CSR |
86 | Table 46 Node ROM Specified Locations |
87 | 3.2.4.1 Bus Information Block 3.2.4.2 MODULE-LOGICAL-CAPABILITY Futurebus+ Required BUS INFORMATION BLOCK ROM Entries Table |
88 | MODULE-LOGICAL-CAPABILITY CSR Bit Descriptions Table |
90 | Fig 31 (a) MODULE-LOGICAL-CAPABILITY (Most Significant Half) MODULE-LOGICAL-CAPABILITY (Least Significant Half) |
91 | 3.2.4.3 NODE-CAPABILITIES-EXT NODE-CAPABILITIES-EXT CSR Bit Descriptions Table |
92 | 3.2.4.4 COMPETITION-INTERNAL-DELAY CSR Format of the NODE-CAPABILITIES-EXT CSR |
93 | 3.2.4.5 PACKET-SPEED CSR 3.2.4.6 MESSAGE-FRAME-SIZE CSR Format of the COMPETITION-INTERNAL-DELAY CSR Format of the PACKET-SPEED CSR |
94 | Busy Retry Capability CSRs Error Retry Capability CSRs Format of the MESSAGE-FRAME-SIZE CSR |
95 | Core CSR Root Directory Table 50 (a) ROM Directory Entry Format Table 50 (b) Directory ï¬Key Typefl Definitions Table 50 (c) Directory Entry Keys |
97 | 3.2.5.1 MODULE-VENDOR-ID ROM Entry MODULE-SPEC-ID ROM Entry NODE-CAPABILITIES ROM Entry |
98 | NODE-CAPABILITIES CSR Bit Descriptions |
99 | MODULE-HW-VERSION ROM Entry Bus Visible Address RAM Format of the NODE-CAPABILITIES Entry |
100 | Format of the NODE-MEMORY-EXTENT Entry MEMORY-EXTENT Bit Descriptions |
101 | Vendor-Defined ROM Entries MODULE-VENDOR-DEPENDENT-INFO ROM Entry Initial Units Space Interrupts Format of the NODE-UNITS-EXTENT Entry UNITS-EXTENT Bit Descriptions |
102 | Distributed Arbitration Messages and General Arbitrated Messages |
103 | Live Insertion 4.1 Description 4.1.1 Introduction 4.1.2 General Considerations 4.1.3 Levels of Live Insertion |
104 | Level 1 Live Insertion and Withdrawal Level 2 Live Insertion and Withdrawal Level 3 Live Insertion and Withdrawal |
105 | 4.1.4 Operator Facilities Live Insertion State Diagram |
106 | Live Insertion Module State Diagram Node Indicator Relationship to State |
107 | Conceptual Module Design |
109 | 4.2 Specification 4.2.1 Definitions System Operation Requirements Functional Design of a Live Insertion Module |
110 | Live Insertion Power Requirements 4.2.4 Module Activation and Deactivation Live Insertion ESD Requirements 4.2.6 Live Insertion Electrical Requirements Level 1 Requirements Level 2 Requirements |
111 | Level 3 Requirements Futurebus+ Live Insertion Glyph Definition of SWAP Indicator Futurebus+ Live Insertion Glyph |
112 | 5 Introduction to Application Environment Profiles Application Environment Profile (AEP) Description Futurebus+ Open Systems Protocol Stack |
113 | Minimum Requirements for AEPs (AEP Specification) AEP Terminology and Definitions Organization |
114 | Profile Content 5.2.3.1 Arbitration 5.2.3.2 Parallel Protocol |
115 | Timing Specification Global Timing Specifications Timing Specifications for (Arbitration Type) Arbitration Timing Specifications for the Arbitrated Message Bus Used for Messages Timing Specifications for the Parallel Protocol |
116 | CSRs Cache Coherence Message Passing Systems Configurations Physical Layer 5.2.4.1 Power Supply Specifications |
117 | Profile Electrical and Signaling Environment |
118 | 5.2.4.3 Live Insertion 5.2.4.4 Mechanical |
119 | 5.2.4.5 InpuVOutput 5.2.4.6 Connector and Pinout Assignment Environmental Standards Requirements |
120 | Application Environment Profile A 6.1 Reference Specification 6.1.1 Introduction Target Market and Applications 6.1.3 Terminology 6.1.4 Referenced Documents 6.1.5 Reference Tables 6.1.6 Profiles Interoperability |
121 | Profile A Logical Layer Referenced Specifications |
123 | Profile A Physical Layer Referenced Specifications |
125 | 6.2 Detailed Specification Arbitration |
126 | Parallel Protocol 6.2.2.1 Transaction Types |
127 | 6.2.2.2 Tag Bits 6.2.2.3 Serial Bus Busmode Management and CSRs 6.2.3.1 Addressing Byte-Lane Wiring and Byte Ordering 6.2.3.3 Interrupts 6.2.3.4 Diagnostics and Test |
128 | 6.2.3.5 CSRs CSR Address Space Profile A Core CSRs |
130 | Profile A Specific CSRs |
131 | Cache Coherence Message Passing System Configuration Profile A ROM Registers |
132 | 6.2.6.1 Monarch Selection Profile A Power 6.2.7.1 Module Power |
134 | 6.2.8 Profile A Electrical 6.2.8.1 Signal Integrity Profile A Power Rails |
135 | Functional Electrical Requirements Live Insertion and Withdrawal |
136 | 6.2.9.1 Alignment Live Insertion Power Live Insertion and Withdrawal Safety |
137 | 6.2.10 Mechanical Specifications |
138 | View of Subrack/Backplane Relationship |
139 | Connector |
140 | View of Plug-in Module |
141 | Detail ï¬C fl Alignment Pin Position on Front Panel and Subrack |
142 | Detail ï¬B fl Front Panel Section |
143 | and Alignment Pin Position |
144 | Design Features |
146 | Heights X-Z View |
147 | Calculation of Maximum Component Heights |
148 | Profile A Front Panel Organization |
150 | EM1 Considerations Module Status State Diagram |
151 | EMI/RFI Shielding Locations and Interfacing Surfaces-Preferred |
152 | 6.2.10.4 Injector/Ejector Mechanism EMI/RFI Shielding Locations and Interfacing Surfaces Alternative |
153 | Bus Connector Mechanical 6.2.11 Inputloutput Profile A Connector Power and Signal Pin Assignment Assignment |
154 | Signal Pin Assignment Connector Naming Conventions |
155 | Power Pin Assignment 6.2.12.4 Connector Keying Environmental Specifications and Other Standards Compliance |
156 | Connector B and X Pinouts for 64/32-Bit Address and Data Paths |
157 | Connector E Pinout for 128-Bit Data Path Extension |
158 | Connector E Pinout for 192 I/O |
159 | Connector E Pinout for 128-Bit Extension and 80 I/O |
160 | Subrack Air Flow and Thermal Considerations Profile A Power Connector Pin Assignment |
161 | 6.2.13.2 Safety and EM1 Standards |
162 | Application Environment Profile B 7.1 Reference Specification 7.1.1 Introduction Target Market and Applications 7.1.3 Profile B Terminology 7.1.4 Referenced Documents 7.1.5 Reference Tables Profile B Logical Layer Referenced Specifications |
164 | Profile B Physical Layer Referenced Specifications |
166 | Multiple Profile Interoperability 7.2 Detailed Specification Arbitration 7.2.1.1 Central Arbitration |
167 | 7.2.1.2 Distributed Arbitration Parallel Protocol 7.2.2.1 Transaction Types |
168 | 7.2.2.2 Prohibited Operations |
169 | 7.2.2.3 Timing Specifications Global Timing Specifications Timing Specifications for Central Arbitration |
170 | 7.2.2.4 Tag Bits the Power Fail Timing Specifications for the Parallel Protocol |
171 | 7.2.2.5 Serial Bus Busmode Management and CSRs 7.2.3.1 Addressing Byte Ordering 7.2.3.3 Interrupts 7.2.3.4 DMA and Test CSRs CSR Address Space |
172 | Profile B Core CSRs |
173 | Profile B Futurebus+ Specific CSRs |
174 | Caching and Cache Coherence Message Passing Profile B ROM Registers |
175 | System Configuration Profile B Power 7.2.7.1 Module Power 7.2.7.2 System Power Supplies |
177 | Profile B Power Rails Profile B Power Supply Sequencing |
179 | Profile B Electrical 7.2.8.1 Signal Integrity |
180 | Backplane Characteristics |
181 | Functional Electrical Requirements Module Signal Line Characteristics |
183 | Live Insertion and Withdrawal Level 1 Live Insertion |
184 | Level 2 Live Insertion 7.2.9.3 Alignment Live Insertion Power Live Insertion and Withdrawal Safety Mechanical |
185 | 7.2.10.1 Subrack Mechanical Specifications |
186 | X-Y View of Subrack and Module Relationship |
187 | Design Features Installed Connector |
188 | Calculation of Maximum Component Heights |
189 | Y-Z View of Plug-in Unit |
190 | X-Y View of Plug-in Unit |
191 | Recommended Injector/Ejector Lever for Profile B |
192 | Heights X-Z View |
194 | Profile B Front Panel Organization Fig |
195 | Module Status State Diagram Fig |
196 | 7.2.10.3 EM1 Considerations |
197 | EMI/RFI Shielding Locations and Interfacing Surfaces-Preferred Fig |
198 | 7.2.10.4 Injector/Ejector Mechanism EMI/RFI Shielding Locations and Interfacing Surfaces-Alternative Fig |
199 | Bus Connector Mechanical Inputloutput Profile B Connector Power and Signal Pin Assignment Assignment |
200 | Signal Pin Assignment Connector Naming Conventions Fig |
201 | Connectors B and X Pinouts for 64/32-Bit Address and Data Paths Fig |
202 | Connector E Pinout for 128-Bit Extension and 80 1/0 Fig |
203 | Power Pin Assignment Profile B Power Connector Pin Assignment Fig |
204 | Environmental Specifications and Other Standards Compliance Subrack Air Flow and Thermal Considerations 7.2.13.2 Safety and EM1 Standards |
205 | Application Environment Profile F 8.1 Reference Specifications 8.1.1 Introduction Target Market and Applications 8.1.3 Profile F Terminology 8.1.4 IEEE Standards Referenced 8.1.5 Reference Tables |
206 | Profile F Logical Layer Referenced Specifications |
207 | Multiple Profile Interoperability 8.1.6.1 Profile A Interoperability Profile B Interoperability |
208 | 8.2 Detailed Specification 8.2.1 Arbitration 8.2.2 Parallel Protocol |
209 | 8.2.2.1 Transaction Types 8.2.2.2 Split Transactions 8.2.2.3 Locked Operations 8.2.2.4 Packet Data Transfers |
210 | 8.2.2.5 Busy 8.2.2.6 Tag Bits 8.2.2.7 Serial Bus Retry Delay Times |
211 | 8.2.3 Timing Specifications Global Timing Specifications |
212 | Timing Specifications for Central Arbitration Timing Specifications for Arbited Messages Timing Specifications for the Parallel Protocol |
214 | Budsystem Management and CSRs 8.2.4.1 Addressing 8.2.4.2 Byte-Lane Wiring and Byte Ordering 8.2.4.3 Interrupts 8.2.4.4 Diagnostics and Test 8.2.4.5 CSRs Profile F Core CSRs |
216 | Profile F Futurebus+ Specific CSRs Profile F ROM CSRs |
217 | Caching and Cache Coherence Message Passing System Configuration Monarch Selection Description |
218 | Monarch Selection Attribute Specification Power Supply Electrical Wire-OR Glitch Filters Live Insertion and Withdrawal Mechanical InputlOutput Connector Power and Signal Pin Assignment Non-Central Arbiter Slot 8.2.13.2 Central Arbiter Slot |
219 | Connector E Pinout for Central Arbiter Slot Fig |
220 | Environmental Specification for a Module-Based Central Arbiter 8.3.1 Backplane Requirements 8.3.1.1 Wiring Geographical Address Assignment Backplane Delay Encoding on BD[2 01* |