IEEE ISO IEC 14575 2001
$113.21
ISO/IEC 14575:2000 (IEEE Std 1355-1995) Information Technology — Microprocessor systems — Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
| Published By | Publication Date | Number of Pages |
| IEEE | 2001 | 147 |
New IEEE Standard – Active. Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Title Page |
| 2 | Copyright Page |
| 5 | Introduction Participants |
| 8 | CONTENTS |
| 11 | 1. Overview 1.1 Scope 1.2 Purpose 2. References |
| 13 | 3. Definitions 3.1 General 3.2 Glossary |
| 16 | 4. Physical media and logical layers 4.1 Physical media |
| 17 | 4.2 Logical layers |
| 20 | 4.3 Interaction of layers |
| 22 | 4.4 Implementations defined in the standard |
| 24 | 5. DS-SE and DS-DE 5.1 General 5.2 DS-SE: physical medium |
| 25 | 5.3 DS-SE signal level |
| 30 | 5.4 DS-DE: physical medium |
| 35 | 5.5 DS-DE signal level |
| 37 | 5.6 DS-SE and DS-DE character level |
| 39 | 5.7 DS-SE and DS-DE exchange level |
| 42 | 6. TS-FO-02 fiber optic link 6.1 Physical medium |
| 44 | 6.2 Signal level |
| 46 | 6.3 TS-FO character level |
| 51 | 7. HS-SE-10 7.1 HS-SE physical medium |
| 55 | 7.2 HS-SE signal level |
| 58 | 7.3 HS character level (8B/12B code) |
| 75 | 7.4 HS exchange level |
| 83 | 8. HS-FO-10 fiber optic link 8.1 Physical medium |
| 85 | 8.2 Signal level |
| 87 | 8.3 Character level end exchange level 9. Common packet level 9.1 General discussion |
| 88 | 9.2 Packet format |
| 89 | 9.3 Networks and routing 9.4 Error detection, recovery, and reporting 10. Conformance criteria 10.1 Conformance statements 10.2 Definition of subsets |
| 90 | 10.3 Conformance statements and cable markings |
| 91 | Annex A (Normative) DS-DE connector specification |
| 98 | Annex B (Normative) HS-SE connector specification |
| 103 | Annex C (Normative) TS-FO and HS-FO connector specifications |
| 117 | Annex D (Informative) Rationale |
| 121 | Annex E (Informative) Switch chips, switches, and fabrics |
| 122 | Annex F (Informative) Use of the transaction layer—Asynchronous transfer mode (ATM) example |
| 131 | Annex G (Informative) Error handling |
| 132 | Annex H (Informative) Flow control calculations |
| 134 | Annex I (Informative) Synchronized channel communications |
| 137 | Annex J (Informative) Example DS-SE driver circuit |
| 139 | Annex K (Informative) DS-DE optional power supply recommendation |
| 140 | Annex L (Informative) DS-DE fixed connector PCB recommendation |
| 141 | Annex M (Informative) DS-DE cable (10 core) recommendation |
| 142 | Annex N (Informative) DS-DE multiway connector housing recommendation |
| 143 | Annex O (Informative) HS-SE fixed connector PCB recommendation |
| 144 | Annex P (Informative) HS-SE cable recommendation |
| 145 | Annex Q (Informative) HS-SE connector multiway housing recommendation |
| 146 | Annex R (Informative)TS/HS-FO connector PCB and front panel cut-out recommendation |
| 147 | Annex S (Informative) TS/HS-FO fiber cable recommendation |
