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IEEE P802.3bm D3.2 Sept2014 DRAFT

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IEEE Draft Standard for Ethernet Amendment: Physical Layer Specifications and Management Parameters for 40 Gb/s and 100 Gb/s Operation Over Fiber Optic Cables

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IEEE N/A 199
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Amendment Standard – Unapproved Draft. This amendment to IEEE Std 802.3-2012 adds Physical Layer (PHY) specifications and management parameters for 40 Gb/s operation over single-mode fiber (40GBASE-ER4) and for 100 Gb/s operation over multimode fiber (100GBASE-SR4). This amendment also specifies a four-lane variant of the 100 Gigabit Attachment Unit Interface (CAUI-4) and optional Energy Efficient Ethernet (EEE) for 40 Gb/s and 100 Gb/s operation over fiber optic cables.

PDF Catalog

PDF Pages PDF Title
3 Introduction
11 Contents
22 1. Introduction
1.1.3.2 Compatibility interfaces
1.3 Normative references
1.4 Definitions
23 1.5 Abbreviations
25 22. Reconciliation Sublayer (RS) and Media Independent Interface (MII)
22.2 Functional specifications
22.2.4 Management functions
22.2.4.3 Extended capability registers
22.2.4.3.1 PHY Identifier (Registers 2 and 3)
27 30. Management
30.5.1.1.2 aMAUType
29 45. Management Data Input/Output (MDIO) Interface
45.2 MDIO Interface Registers
45.2.1 PMA/PMD registers
45.2.1.3 PMA/PMD device identifier (Registers 1.2 and 1.3)
45.2.1.6 PMA/PMD control 2 register (Register 1.7)
32 45.2.1.7 PMA/PMD status 2 register (Register 1.8)
45.2.1.7.4 Transmit fault (1.8.11)
45.2.1.7.5 Receive fault (1.8.10)
34 45.2.1.8 PMD transmit disable register (Register 1.9)
45.2.1.12 40G/100G PMA/PMD extended ability register (Register 1.13)
35 45.2.1.12.5a 100GBASE-SR4 ability (1.13.7)
45.2.1.12.5b 40GBASE-ER4 ability (1.13.5)
36 45.2.1.92aa CAUI-4 chip-to-module recommended CTLE register (Register 1.179)
45.2.1.92aa.1 Recommended CTLE peaking (1.179.4:1)
45.2.1.92ab CAUI-4 chip-to-chip transmitter equalization, receive direction, lane 0 register (Register 1.180)
45.2.1.92ab.1 Request flag (1.180.15)
45.2.1.92ab.2 Post-cursor request (1.180.14:12)
38 45.2.1.92ab.3 Pre-cursor request (1.180.11:10)
45.2.1.92ab.4 Post-cursor remote setting (1.180.9:7)
45.2.1.92ab.5 Pre-cursor remote setting (1.180.6:5)
45.2.1.92ab.6 Post-cursor local setting (1.180.4:2)
45.2.1.92ab.7 Pre-cursor local setting (1.180.1:0)
45.2.1.92ac CAUI-4 chip-to-chip transmitter equalization, receive direction, lane 1 through lane 3 registers (Registers 1.181, 1.182, 1.183)
45.2.1.92ad CAUI-4 chip-to-chip transmitter equalization, transmit direction, lane 0 register (Register 1.184)
39 45.2.1.92ad.1 Request flag (1.184.15)
40 45.2.1.92ad.2 Post-cursor request (1.184.14:12)
45.2.1.92ad.3 Pre-cursor request (1.184.11:10)
45.2.1.92ad.4 Post-cursor remote setting (1.184.9:7)
45.2.1.92ad.5 Pre-cursor remote setting (1.184.6:5)
45.2.1.92ad.6 Post-cursor local setting (1.184.4:2)
45.2.1.92ad.7 Pre-cursor local setting (1.184.1:0)
41 45.2.1.92ae CAUI-4 chip-to-chip transmitter equalization, transmit direction, lane 1 through lane 3 registers (Registers 1.185, 1.186, 1.187)
45.2.3 PCS registers
45.2.3.46 Lane 0 mapping register (Register 3.400)
43 69. Introduction to Ethernet operation over electrical backplanes
69.1 Overview
69.1.2 Relationship of Backplane Ethernet to the ISO OSI reference model
69.2 Summary of Backplane Ethernet Sublayers
69.2.3 Physical Layer signaling systems
45 74. Forward Error Correction (FEC) sublayer for BASE-R PHYs
74.4 Inter-sublayer interfaces
74.5 FEC service interface
47 78. Energy-Efficient Ethernet (EEE)
78.1 Overview
78.1.1 LPI Signaling
78.1.3 Reconciliation sublayer operation
78.1.3.3 PHY LPI operation
78.1.3.3.1 PHY LPI transmit operation
78.1.4 PHY types optionally supporting EEE
48 78.5 Communication link access latency
49 78.5.2 40 Gb/s and 100 Gb/s PHY extension using XLAUI or CAUI-n
51 80. Introduction to 40 Gb/s and 100 Gb/s networks
80.1 Overview
80.1.3 Relationship of 40 Gigabit and 100 Gigabit Ethernet to the ISO OSI reference model
80.1.4 Nomenclature
80.1.5 Physical Layer signaling systems
53 80.2 Summary of 40 Gigabit and 100 Gigabit Ethernet sublayers
80.2.3 Forward Error Correction (FEC) sublayers
80.2.5 Physical Medium Dependent (PMD) sublayer
80.4 Delay constraints
54 80.5 Skew constraints
59 80.7 Protocol implementation conformance statement (PICS) proforma
61 81. Reconciliation Sublayer (RS) and Media Independent Interface for 40 Gb/s and 100 Gb/s operation (XLGMII and CGMII)
81.3a LPI Assertion and Detection
81.3a.2 Transmit LPI state diagram
81.3a.2.1 Variables and counters
81.3a.4 Considerations for receive system behavior
63 82. Physical Coding Sublayer (PCS) for 64B/66B, type 40GBASE-R and 100GBASE-R
82.1 Overview
82.1.4 Inter-sublayer interfaces
82.2 Physical Coding Sublayer (PCS)
82.2.6 Block distribution
65 83. Physical Medium Attachment (PMA) sublayer, type 40GBASE-R and 100GBASE-R
83.1 Overview
83.1.1 Scope
83.1.4 PMA sublayer positioning
67 83.2 PMA Interfaces
68 83.3 PMA service interface
83.4 Service interface below PMA
83.5 Functions within the PMA
83.5.1 Per input-lane clock and data recovery
83.5.3 Skew and Skew Variation
83.5.3.a Skew generation toward SP0
69 83.5.3.1 Skew generation toward SP1
83.5.3.2 Skew tolerance at SP1
83.5.3.3 Skew generation toward SP2
83.5.3.5 Skew generation at SP6
83.5.3.6 Skew tolerance at SP6
83.5.3.7 Skew generation towards SP7
70 83.5.6 Signal drivers
83.5.10 PMA test patterns (optional)
83.5.11 Energy Efficient Ethernet
71 83.5.11.3 Additional transmit functions in the Tx direction
83.5.11.4 Additional receive functions in the Tx direction
83.5.11.5 Additional transmit functions in the Rx direction
72 83.5.11.6 Additional receive functions in the Rx direction
83.7 Protocol implementation conformance statement (PICS) proforma for Clause 83, Physical Medium Attachment (PMA) sublayer, type 40GBASE-R and 100GBASE-R
83.7.3 Major capabilities/options
73 83.7.4 Test patterns
83.7.7 EEE deep sleep with XLAUI/CAUI-n
75 85. Physical Medium Dependent sublayer and baseband medium, type 40GBASE-CR4 and 100GBASE-CR10
85.1 Overview
85.3 PCS requirements for Auto-Negotiation (AN) service interface
85.13 Protocol implementation conformance statement (PICS) proforma for Clause 85, Physical Medium Dependent (PMD) sublayer and baseband medium, type 40GBASE-CR4 and 100GBASE-CR10
85.13.3 Major capabilities/options
77 86. Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE–SR4 and 100GBASE–SR10
86.1 Overview
78 86.8 Definitions of optical and dual-use parameters and measurement methods
86.8.4 Optical parameter definitions
86.8.4.7 Stressed receiver sensitivity
86.10 Optical channel
86.10.1 Fiber optic cabling model
79 87. Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE–LR4 and 40GBASE–ER4
87.1 Overview
80 87.2 Physical Medium Dependent (PMD) service interface
87.3 Delay and Skew
87.3.1 Delay constraints
81 87.5 PMD functional specifications
87.5.1 PMD block diagram
82 87.6 Wavelength-division-multiplexed lane assignments
87.7 PMD to MDI optical specifications for 40GBASE–LR4 and 40GBASE–ER4
83 87.7.1 40GBASE–LR4 and 40GBASE–ER4 transmitter optical specifications
84 87.7.2 40GBASE–LR4 and 40GBASE–ER4 receive optical specifications
85 87.7.3 40GBASE–LR4 and 40GBASE–ER4 illustrative link power budgets
87.8 Definition of optical parameters and measurement methods
87.8.1 Test patterns for optical parameters
86 87.8.4 Average optical power
87.8.6 Transmitter and dispersion penalty
87.8.6.2 Channel requirements
87 87.8.7 Extinction ratio
87.8.11 Stressed receiver sensitivity
87.8.11.5 Stressed receiver conformance test procedure for WDM conformance testing
87.9 Safety, installation, environment, and labeling
88 87.9.2 Laser safety
87.9.4 Environment
87.9.4.1 Electromagnetic emission
87.10 Fiber optic cabling model
89 87.11 Characteristics of the fiber optic cabling (channel)
87.11.1 Optical fiber cable
87.11.3 Medium Dependent Interface (MDI) requirements
87.12 Requirements for interoperation between 40GBASE-LR4 and 40GBASE-ER4
90 87.13 Protocol implementation conformance statement (PICS) proforma for Clause 87, Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE-LR4 and 40GBASE-ER4
87.13.1 Introduction
87.13.2 Identification
87.13.2.2 Protocol summary
87.13.3 Major capabilities/options
87.13.4 PICS proforma tables for Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE-LR4 and 40GBASE-ER4
91 87.13.4.3 PMD to MDI optical specifications for 40GBASE-LR4
87.13.4.3a PMD to MDI optical specifications for 40GBASE-ER4
93 88. Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE–LR4 and 100GBASE–ER4
88.1 Overview
95 89. Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE-FR
89.1 Overview
97 91. Reed-Solomon Forward Error Correction (RS-FEC) sublayer for 100GBASE-R PHYs
91.2 FEC service interface
91.3 PMA compatibility
91.5 Functions within the RS-FEC sublayer
91.5.2 Transmit function
91.5.2.7 Reed-Solomon encoder
91.5.3 Receive function
91.5.3.3 Reed-Solomon decoder
98 91.7 Protocol implementation conformance statement (PICS) proforma for Clause 91, Reed-Solomon Forward Error Correction (RS-FEC) sublayer for 100GBASE-R PHYs
91.7.3 Major capabilities/options
91.7.4 PICS proforma tables for Reed-Solomon Forward Error Correction (RS-FEC) sublayer for 100GBASE-R PHYs
91.7.4.1 Transmit function
99 91.7.4.2 Receive function
101 92. Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-CR4
92.1 Overview
92.3 PCS requirements for Auto-Negotiation (AN) service interface
92.14 Protocol implementation conformance statement (PICS) proforma for Clause 92, Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-CR4
92.14.3 Major capabilities/options
103 93. Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KR4
93.1 Overview
93.3 PCS requirements for Auto-Negotiation (AN) service interface
93.11 Protocol implementation conformance statement (PICS) proforma for Clause 93, Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KR4
93.11.3 Major capabilities/options
105 94. Physical Medium Attachment (PMA) sublayer, Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KP4
94.1 Overview
94.3 Physical Medium Dependent (PMD) Sublayer
94.3.2 PCS requirements for Auto-Negotiation (AN) service interface
94.6 Protocol implementation conformance statement (PICS) proforma for Clause 94, Physical Medium Attachment (PMA) and Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KP4
94.6.3 Major capabilities/options
107 95. Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE-SR4
95.1 Overview
108 95.1.1 Bit error ratio
95.2 Physical Medium Dependent (PMD) service interface
109 95.3 Delay and Skew
95.3.1 Delay constraints
95.3.2 Skew constraints
110 95.4 PMD MDIO function mapping
95.5 PMD functional specifications
111 95.5.1 PMD block diagram
95.5.2 PMD transmit function
95.5.3 PMD receive function
112 95.5.4 PMD global signal detect function
95.5.5 PMD lane-by-lane signal detect function
95.5.6 PMD reset function
113 95.5.7 PMD global transmit disable function (optional)
95.5.8 PMD lane-by-lane transmit disable function (optional)
95.5.9 PMD fault function (optional)
95.5.10 PMD transmit fault function (optional)
95.5.11 PMD receive fault function (optional)
95.6 Lane assignments
114 95.7 PMD to MDI optical specifications for 100GBASE-SR4
95.7.1 100GBASE-SR4 transmitter optical specifications
115 95.7.2 100GBASE-SR4 receive optical specifications
116 95.7.3 100GBASE-SR4 illustrative link power budget
95.8 Definition of optical parameters and measurement methods
95.8.1 Test patterns for optical parameters
117 95.8.1.1 Multi-lane testing considerations
95.8.2 Center wavelength and spectral width
118 95.8.3 Average optical power
95.8.4 Optical Modulation Amplitude (OMA)
95.8.5 Transmitter vertical and dispersion eye closure (TxVECTDEC)
95.8.5.1 TxVEC TDEC conformance test set-up
95.8.5.2 TxVEC TDEC measurement method
122 95.8.6 Extinction ratio
95.8.7 Transmitter optical waveform (transmit eye)
95.8.8 Stressed receiver sensitivity
95.8.8.1 Stressed receiver conformance test block diagram
123 95.8.8.2 Stressed receiver conformance test signal characteristics and calibration
126 95.8.8.3 J2 and J4 Jitter
95.8.8.4 Stressed receiver conformance test signal verification
127 95.8.8.5 Sinusoidal jitter for receiver conformance test
95.9 Safety, installation, environment, and labeling
95.9.1 General safety
95.9.2 Laser safety
95.9.3 Installation
128 95.9.4 Environment
95.9.5 Electromagnetic emission
95.9.6 Temperature, humidity, and handling
95.9.7 PMD labeling requirements
95.10 Fiber optic cabling model
129 95.11 Characteristics of the fiber optic cabling (channel)
95.11.1 Optical fiber cable
130 95.11.2 Optical fiber connection
95.11.2.1 Connection insertion loss
95.11.2.2 Maximum discrete reflectance
95.11.3 Medium Dependent Interface (MDI)
95.11.3.1 Optical lane assignments
95.11.3.2 Medium Dependent Interface (MDI) requirements
132 95.12 Protocol implementation conformance statement (PICS) proforma for Clause 95, Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE-SR4
95.12.1 Introduction
95.12.2 Identification
95.12.2.1 Implementation identification
95.12.2.2 Protocol summary
133 95.12.3 Major capabilities/options
134 95.12.4 PICS proforma tables for Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE-SR4
95.12.4.1 PMD functional specifications
135 95.12.4.2 Management functions
136 95.12.4.3 PMD to MDI optical specifications for 100GBASE-SR4
95.12.4.4 Optical measurement methods
95.12.4.5 Environmental specifications
137 95.12.4.6 Characteristics of the fiber optic cabling and MDI
139 Annex A (informative) Bibliography
141 Annex 83A (normative) 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten-lane Attachment Unit Interface (CAUI-10)
83A.1 Overview
142 83A.1.1 Summary of major concepts
83A.1.2 Rate of operation
83A.2 XLAUI/CAUI-10 link block diagram
143 83A.3 XLAUI/CAUI-10 electrical characteristics
83A.3.1 Signal levels
83A.3.2 Signal paths
83A.3.2a EEE operation
144 83A.3.3 Transmitter characteristics
83A.3.3.1 Output amplitude
83A.3.3.1.1 Amplitude and swing
83A.3.3.6 Global transmit disable function
83A.3.4 Receiver characteristics
145 83A.3.4.2 Input signal definition
83A.3.4.5 AC coupling
83A.3.4.6 Jitter tolerance
83A.3.4.7 Global energy detect function
83A.4 Interconnect characteristics
146 83A.5 Electrical parameter measurement methods
83A.5.1 Transmit jitter
83A.5.2 Receiver tolerance
147 83A.6 Environmental specifications
83A.6.4 Electromagnetic compatibility
83A.6.5 Temperature and humidity
83A.7 Protocol implementation conformance statement (PICS) proforma for Annex 83A, 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten- lane Attachment Unit Interface (CAUI-10)
83A.7.1 Introduction
148 83A.7.2 Identification
83A.7.2.2 Protocol summary
83A.7.3 Major capabilities/options
83A.7.4 XLAUI/CAUI-10 transmitter requirements
149 83A.7.5 XLAUI/CAUI-10 receiver requirements
83A.7.6 Electrical measurement methods
151 Annex 83B (normative) Chip-to-module 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten-lane Attachment Unit Interface (CAUI-10)
83B.1 Overview
152 83B.2 Compliance point specifications for chip-to-module XLAUI/CAUI-10
153 83B.2.1 Module specifications
83B.2.2 Host specifications
83B.2.3 Host input signal tolerance
154 83B.3 Environmental specifications
83B.3.4 Electromagnetic compatibility
83B.3.5 Temperature and humidity
83B.4 Protocol implementation conformance statement (PICS) proforma for Annex 83B, Chip-to-module 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten-lane Attachment Unit Interface (CAUI-10)
155 83B.4.1 Introduction
83B.4.2 Identification
83B.4.2.2 Protocol summary
83B.4.3 Major capabilities/options
83B.4.4 Module requirements
83B.4.5 Host requirements
157 Annex 83C (informative) PMA sublayer partitioning examples
83C.1 Partitioning examples with FEC
83C.1.2 FEC implemented with PMD
158 83C.1a Partitioning examples with RS-FEC
83C.1a.2 Single CAUI-10 with RS-FEC
159 83C.2 Partitioning examples without FEC
83C.2.2 Single XLAUI/CAUI-4 without FEC
160 83C.2.3 Separate SERDES for optical module interface
161 Annex 83D (normative) Chip-to-chip 100 Gb/s four-lane Attachment Unit Interface (CAUI-4)
83D.1 Overview
163 83D.2 CAUI-4 chip-to-chip compliance point definition
83D.3 CAUI-4 chip-to-chip electrical characteristics
83D.3.1 CAUI-4 transmitter characteristics
83D.3.1.1 Transmitter equalization settings
166 83D.3.2 Optional EEE operation
83D.3.3 CAUI-4 receiver characteristics
83D.3.3.1 Receiver interference tolerance
167 83D.3.3.2 Transmitter equalization feedback (optional)
168 83D.3.4 Global energy detect function for optional EEE operation
83D.4 CAUI-4 chip-to-chip channel characteristics
169 83D.5 Example usage of the optional transmitter equalization feedback
83D.5.1 Overview
170 83D.5.2 Tuning equalization settings on lane 0 in the transmit direction
171 83D.5.3 Tuning equalization settings on lane 0 in the receive direction
172 83D.6 Protocol implementation conformance statement (PICS) proforma for Annex 83D, Chip-to-chip 100 Gb/s four-lane Attachment Unit Interface (CAUI-4)
83D.6.1 Introduction
83D.6.2 Identification
83D.6.2.1 Implementation identification
83D.6.2.2 Protocol summary
173 83D.6.3 Major capabilities/options
83D.6.4 PICS proforma tables for chip-to-chip 100 Gb/s four-lane Attachment Unit Interface (CAUI-4)
83D.6.4.1 Transmitter
174 83D.6.4.2 Receiver
83D.6.4.3 Channel
175 Annex 83E (normative) Chip-to-module 100 Gb/s four-lane Attachment Unit Interface (CAUI-4)
83E.1 Overview
177 83E.1.1 Bit error ratio
83E.2 CAUI-4 chip-to-module compliance point definitions
178 83E.3 CAUI-4 chip-to-module electrical characteristics
83E.3.1 CAUI-4 host output characteristics
179 83E.3.1.1 Signaling rate and range
83E.3.1.2 Signal levels
83E.3.1.3 Output return loss
181 83E.3.1.4 Differential termination mismatch
83E.3.1.5 Transition time
83E.3.1.6 Host output eye width and eye height
83E.3.1.6.1 Reference receiver for host output eye width and eye height evaluation
183 83E.3.2 CAUI-4 module output characteristics
184 83E.3.2.1 Module output eye width and eye height
83E.3.2.1.1 Reference receiver for module output eye width and eye height evaluation
83E.3.3 CAUI-4 host input characteristics
185 83E.3.3.1 Input return loss
187 83E.3.3.2 Host stressed input test
83E.3.3.2.1 Host stressed input test procedure
189 83E.3.4 CAUI-4 module input characteristics
83E.3.4.1 Module stressed input test
83E.3.4.1.1 Module stressed input test procedure
192 83E.4 CAUI-4 measurement methodology
83E.4.1 HCB / MCB characteristics
83E.4.2 Eye width and eye height measurement method
193 83E.4.2.1 Vertical eye closure
194 83E.5 Protocol implementation conformance statement (PICS) proforma for Annex 83E, Chip-to-module 100 Gb/s four-lane Attachment Unit Interface (CAUI-4)
83E.5.1 Introduction
83E.5.2 Identification
83E.5.2.1 Implementation identification
83E.5.2.2 Protocol summary
195 83E.5.3 Major capabilities/options
83E.5.4 PICS proforma tables for chip-to-module 100 Gb/s four-lane Attachment Unit Interface (CAUI-4)
83E.5.4.1 Host output
196 83E.5.4.2 Module output
83E.5.4.3 Host input
83E.5.4.4 Module input
199 Annex 93A (normative) Specification methods for electrical channels
93A.1 Channel Operating Margin
IEEE P802.3bm D3.2 Sept2014 DRAFT
$89.38