IEEE P802.3bm D3.2 Sept2014 DRAFT
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IEEE Draft Standard for Ethernet Amendment: Physical Layer Specifications and Management Parameters for 40 Gb/s and 100 Gb/s Operation Over Fiber Optic Cables
Published By | Publication Date | Number of Pages |
IEEE | N/A | 199 |
Amendment Standard – Unapproved Draft. This amendment to IEEE Std 802.3-2012 adds Physical Layer (PHY) specifications and management parameters for 40 Gb/s operation over single-mode fiber (40GBASE-ER4) and for 100 Gb/s operation over multimode fiber (100GBASE-SR4). This amendment also specifies a four-lane variant of the 100 Gigabit Attachment Unit Interface (CAUI-4) and optional Energy Efficient Ethernet (EEE) for 40 Gb/s and 100 Gb/s operation over fiber optic cables.
PDF Catalog
PDF Pages | PDF Title |
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3 | Introduction |
11 | Contents |
22 | 1. Introduction 1.1.3.2 Compatibility interfaces 1.3 Normative references 1.4 Definitions |
23 | 1.5 Abbreviations |
25 | 22. Reconciliation Sublayer (RS) and Media Independent Interface (MII) 22.2 Functional specifications 22.2.4 Management functions 22.2.4.3 Extended capability registers 22.2.4.3.1 PHY Identifier (Registers 2 and 3) |
27 | 30. Management 30.5.1.1.2 aMAUType |
29 | 45. Management Data Input/Output (MDIO) Interface 45.2 MDIO Interface Registers 45.2.1 PMA/PMD registers 45.2.1.3 PMA/PMD device identifier (Registers 1.2 and 1.3) 45.2.1.6 PMA/PMD control 2 register (Register 1.7) |
32 | 45.2.1.7 PMA/PMD status 2 register (Register 1.8) 45.2.1.7.4 Transmit fault (1.8.11) 45.2.1.7.5 Receive fault (1.8.10) |
34 | 45.2.1.8 PMD transmit disable register (Register 1.9) 45.2.1.12 40G/100G PMA/PMD extended ability register (Register 1.13) |
35 | 45.2.1.12.5a 100GBASE-SR4 ability (1.13.7) 45.2.1.12.5b 40GBASE-ER4 ability (1.13.5) |
36 | 45.2.1.92aa CAUI-4 chip-to-module recommended CTLE register (Register 1.179) 45.2.1.92aa.1 Recommended CTLE peaking (1.179.4:1) 45.2.1.92ab CAUI-4 chip-to-chip transmitter equalization, receive direction, lane 0 register (Register 1.180) 45.2.1.92ab.1 Request flag (1.180.15) 45.2.1.92ab.2 Post-cursor request (1.180.14:12) |
38 | 45.2.1.92ab.3 Pre-cursor request (1.180.11:10) 45.2.1.92ab.4 Post-cursor remote setting (1.180.9:7) 45.2.1.92ab.5 Pre-cursor remote setting (1.180.6:5) 45.2.1.92ab.6 Post-cursor local setting (1.180.4:2) 45.2.1.92ab.7 Pre-cursor local setting (1.180.1:0) 45.2.1.92ac CAUI-4 chip-to-chip transmitter equalization, receive direction, lane 1 through lane 3 registers (Registers 1.181, 1.182, 1.183) 45.2.1.92ad CAUI-4 chip-to-chip transmitter equalization, transmit direction, lane 0 register (Register 1.184) |
39 | 45.2.1.92ad.1 Request flag (1.184.15) |
40 | 45.2.1.92ad.2 Post-cursor request (1.184.14:12) 45.2.1.92ad.3 Pre-cursor request (1.184.11:10) 45.2.1.92ad.4 Post-cursor remote setting (1.184.9:7) 45.2.1.92ad.5 Pre-cursor remote setting (1.184.6:5) 45.2.1.92ad.6 Post-cursor local setting (1.184.4:2) 45.2.1.92ad.7 Pre-cursor local setting (1.184.1:0) |
41 | 45.2.1.92ae CAUI-4 chip-to-chip transmitter equalization, transmit direction, lane 1 through lane 3 registers (Registers 1.185, 1.186, 1.187) 45.2.3 PCS registers 45.2.3.46 Lane 0 mapping register (Register 3.400) |
43 | 69. Introduction to Ethernet operation over electrical backplanes 69.1 Overview 69.1.2 Relationship of Backplane Ethernet to the ISO OSI reference model 69.2 Summary of Backplane Ethernet Sublayers 69.2.3 Physical Layer signaling systems |
45 | 74. Forward Error Correction (FEC) sublayer for BASE-R PHYs 74.4 Inter-sublayer interfaces 74.5 FEC service interface |
47 | 78. Energy-Efficient Ethernet (EEE) 78.1 Overview 78.1.1 LPI Signaling 78.1.3 Reconciliation sublayer operation 78.1.3.3 PHY LPI operation 78.1.3.3.1 PHY LPI transmit operation 78.1.4 PHY types optionally supporting EEE |
48 | 78.5 Communication link access latency |
49 | 78.5.2 40 Gb/s and 100 Gb/s PHY extension using XLAUI or CAUI-n |
51 | 80. Introduction to 40 Gb/s and 100 Gb/s networks 80.1 Overview 80.1.3 Relationship of 40 Gigabit and 100 Gigabit Ethernet to the ISO OSI reference model 80.1.4 Nomenclature 80.1.5 Physical Layer signaling systems |
53 | 80.2 Summary of 40 Gigabit and 100 Gigabit Ethernet sublayers 80.2.3 Forward Error Correction (FEC) sublayers 80.2.5 Physical Medium Dependent (PMD) sublayer 80.4 Delay constraints |
54 | 80.5 Skew constraints |
59 | 80.7 Protocol implementation conformance statement (PICS) proforma |
61 | 81. Reconciliation Sublayer (RS) and Media Independent Interface for 40 Gb/s and 100 Gb/s operation (XLGMII and CGMII) 81.3a LPI Assertion and Detection 81.3a.2 Transmit LPI state diagram 81.3a.2.1 Variables and counters 81.3a.4 Considerations for receive system behavior |
63 | 82. Physical Coding Sublayer (PCS) for 64B/66B, type 40GBASE-R and 100GBASE-R 82.1 Overview 82.1.4 Inter-sublayer interfaces 82.2 Physical Coding Sublayer (PCS) 82.2.6 Block distribution |
65 | 83. Physical Medium Attachment (PMA) sublayer, type 40GBASE-R and 100GBASE-R 83.1 Overview 83.1.1 Scope 83.1.4 PMA sublayer positioning |
67 | 83.2 PMA Interfaces |
68 | 83.3 PMA service interface 83.4 Service interface below PMA 83.5 Functions within the PMA 83.5.1 Per input-lane clock and data recovery 83.5.3 Skew and Skew Variation 83.5.3.a Skew generation toward SP0 |
69 | 83.5.3.1 Skew generation toward SP1 83.5.3.2 Skew tolerance at SP1 83.5.3.3 Skew generation toward SP2 83.5.3.5 Skew generation at SP6 83.5.3.6 Skew tolerance at SP6 83.5.3.7 Skew generation towards SP7 |
70 | 83.5.6 Signal drivers 83.5.10 PMA test patterns (optional) 83.5.11 Energy Efficient Ethernet |
71 | 83.5.11.3 Additional transmit functions in the Tx direction 83.5.11.4 Additional receive functions in the Tx direction 83.5.11.5 Additional transmit functions in the Rx direction |
72 | 83.5.11.6 Additional receive functions in the Rx direction 83.7 Protocol implementation conformance statement (PICS) proforma for Clause 83, Physical Medium Attachment (PMA) sublayer, type 40GBASE-R and 100GBASE-R 83.7.3 Major capabilities/options |
73 | 83.7.4 Test patterns 83.7.7 EEE deep sleep with XLAUI/CAUI-n |
75 | 85. Physical Medium Dependent sublayer and baseband medium, type 40GBASE-CR4 and 100GBASE-CR10 85.1 Overview 85.3 PCS requirements for Auto-Negotiation (AN) service interface 85.13 Protocol implementation conformance statement (PICS) proforma for Clause 85, Physical Medium Dependent (PMD) sublayer and baseband medium, type 40GBASE-CR4 and 100GBASE-CR10 85.13.3 Major capabilities/options |
77 | 86. Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE–SR4 and 100GBASE–SR10 86.1 Overview |
78 | 86.8 Definitions of optical and dual-use parameters and measurement methods 86.8.4 Optical parameter definitions 86.8.4.7 Stressed receiver sensitivity 86.10 Optical channel 86.10.1 Fiber optic cabling model |
79 | 87. Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE–LR4 and 40GBASE–ER4 87.1 Overview |
80 | 87.2 Physical Medium Dependent (PMD) service interface 87.3 Delay and Skew 87.3.1 Delay constraints |
81 | 87.5 PMD functional specifications 87.5.1 PMD block diagram |
82 | 87.6 Wavelength-division-multiplexed lane assignments 87.7 PMD to MDI optical specifications for 40GBASE–LR4 and 40GBASE–ER4 |
83 | 87.7.1 40GBASE–LR4 and 40GBASE–ER4 transmitter optical specifications |
84 | 87.7.2 40GBASE–LR4 and 40GBASE–ER4 receive optical specifications |
85 | 87.7.3 40GBASE–LR4 and 40GBASE–ER4 illustrative link power budgets 87.8 Definition of optical parameters and measurement methods 87.8.1 Test patterns for optical parameters |
86 | 87.8.4 Average optical power 87.8.6 Transmitter and dispersion penalty 87.8.6.2 Channel requirements |
87 | 87.8.7 Extinction ratio 87.8.11 Stressed receiver sensitivity 87.8.11.5 Stressed receiver conformance test procedure for WDM conformance testing 87.9 Safety, installation, environment, and labeling |
88 | 87.9.2 Laser safety 87.9.4 Environment 87.9.4.1 Electromagnetic emission 87.10 Fiber optic cabling model |
89 | 87.11 Characteristics of the fiber optic cabling (channel) 87.11.1 Optical fiber cable 87.11.3 Medium Dependent Interface (MDI) requirements 87.12 Requirements for interoperation between 40GBASE-LR4 and 40GBASE-ER4 |
90 | 87.13 Protocol implementation conformance statement (PICS) proforma for Clause 87, Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE-LR4 and 40GBASE-ER4 87.13.1 Introduction 87.13.2 Identification 87.13.2.2 Protocol summary 87.13.3 Major capabilities/options 87.13.4 PICS proforma tables for Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE-LR4 and 40GBASE-ER4 |
91 | 87.13.4.3 PMD to MDI optical specifications for 40GBASE-LR4 87.13.4.3a PMD to MDI optical specifications for 40GBASE-ER4 |
93 | 88. Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE–LR4 and 100GBASE–ER4 88.1 Overview |
95 | 89. Physical Medium Dependent (PMD) sublayer and medium, type 40GBASE-FR 89.1 Overview |
97 | 91. Reed-Solomon Forward Error Correction (RS-FEC) sublayer for 100GBASE-R PHYs 91.2 FEC service interface 91.3 PMA compatibility 91.5 Functions within the RS-FEC sublayer 91.5.2 Transmit function 91.5.2.7 Reed-Solomon encoder 91.5.3 Receive function 91.5.3.3 Reed-Solomon decoder |
98 | 91.7 Protocol implementation conformance statement (PICS) proforma for Clause 91, Reed-Solomon Forward Error Correction (RS-FEC) sublayer for 100GBASE-R PHYs 91.7.3 Major capabilities/options 91.7.4 PICS proforma tables for Reed-Solomon Forward Error Correction (RS-FEC) sublayer for 100GBASE-R PHYs 91.7.4.1 Transmit function |
99 | 91.7.4.2 Receive function |
101 | 92. Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-CR4 92.1 Overview 92.3 PCS requirements for Auto-Negotiation (AN) service interface 92.14 Protocol implementation conformance statement (PICS) proforma for Clause 92, Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-CR4 92.14.3 Major capabilities/options |
103 | 93. Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KR4 93.1 Overview 93.3 PCS requirements for Auto-Negotiation (AN) service interface 93.11 Protocol implementation conformance statement (PICS) proforma for Clause 93, Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KR4 93.11.3 Major capabilities/options |
105 | 94. Physical Medium Attachment (PMA) sublayer, Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KP4 94.1 Overview 94.3 Physical Medium Dependent (PMD) Sublayer 94.3.2 PCS requirements for Auto-Negotiation (AN) service interface 94.6 Protocol implementation conformance statement (PICS) proforma for Clause 94, Physical Medium Attachment (PMA) and Physical Medium Dependent (PMD) sublayer and baseband medium, type 100GBASE-KP4 94.6.3 Major capabilities/options |
107 | 95. Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE-SR4 95.1 Overview |
108 | 95.1.1 Bit error ratio 95.2 Physical Medium Dependent (PMD) service interface |
109 | 95.3 Delay and Skew 95.3.1 Delay constraints 95.3.2 Skew constraints |
110 | 95.4 PMD MDIO function mapping 95.5 PMD functional specifications |
111 | 95.5.1 PMD block diagram 95.5.2 PMD transmit function 95.5.3 PMD receive function |
112 | 95.5.4 PMD global signal detect function 95.5.5 PMD lane-by-lane signal detect function 95.5.6 PMD reset function |
113 | 95.5.7 PMD global transmit disable function (optional) 95.5.8 PMD lane-by-lane transmit disable function (optional) 95.5.9 PMD fault function (optional) 95.5.10 PMD transmit fault function (optional) 95.5.11 PMD receive fault function (optional) 95.6 Lane assignments |
114 | 95.7 PMD to MDI optical specifications for 100GBASE-SR4 95.7.1 100GBASE-SR4 transmitter optical specifications |
115 | 95.7.2 100GBASE-SR4 receive optical specifications |
116 | 95.7.3 100GBASE-SR4 illustrative link power budget 95.8 Definition of optical parameters and measurement methods 95.8.1 Test patterns for optical parameters |
117 | 95.8.1.1 Multi-lane testing considerations 95.8.2 Center wavelength and spectral width |
118 | 95.8.3 Average optical power 95.8.4 Optical Modulation Amplitude (OMA) 95.8.5 Transmitter vertical and dispersion eye closure (TxVECTDEC) 95.8.5.1 TxVEC TDEC conformance test set-up 95.8.5.2 TxVEC TDEC measurement method |
122 | 95.8.6 Extinction ratio 95.8.7 Transmitter optical waveform (transmit eye) 95.8.8 Stressed receiver sensitivity 95.8.8.1 Stressed receiver conformance test block diagram |
123 | 95.8.8.2 Stressed receiver conformance test signal characteristics and calibration |
126 | 95.8.8.3 J2 and J4 Jitter 95.8.8.4 Stressed receiver conformance test signal verification |
127 | 95.8.8.5 Sinusoidal jitter for receiver conformance test 95.9 Safety, installation, environment, and labeling 95.9.1 General safety 95.9.2 Laser safety 95.9.3 Installation |
128 | 95.9.4 Environment 95.9.5 Electromagnetic emission 95.9.6 Temperature, humidity, and handling 95.9.7 PMD labeling requirements 95.10 Fiber optic cabling model |
129 | 95.11 Characteristics of the fiber optic cabling (channel) 95.11.1 Optical fiber cable |
130 | 95.11.2 Optical fiber connection 95.11.2.1 Connection insertion loss 95.11.2.2 Maximum discrete reflectance 95.11.3 Medium Dependent Interface (MDI) 95.11.3.1 Optical lane assignments 95.11.3.2 Medium Dependent Interface (MDI) requirements |
132 | 95.12 Protocol implementation conformance statement (PICS) proforma for Clause 95, Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE-SR4 95.12.1 Introduction 95.12.2 Identification 95.12.2.1 Implementation identification 95.12.2.2 Protocol summary |
133 | 95.12.3 Major capabilities/options |
134 | 95.12.4 PICS proforma tables for Physical Medium Dependent (PMD) sublayer and medium, type 100GBASE-SR4 95.12.4.1 PMD functional specifications |
135 | 95.12.4.2 Management functions |
136 | 95.12.4.3 PMD to MDI optical specifications for 100GBASE-SR4 95.12.4.4 Optical measurement methods 95.12.4.5 Environmental specifications |
137 | 95.12.4.6 Characteristics of the fiber optic cabling and MDI |
139 | Annex A (informative) Bibliography |
141 | Annex 83A (normative) 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten-lane Attachment Unit Interface (CAUI-10) 83A.1 Overview |
142 | 83A.1.1 Summary of major concepts 83A.1.2 Rate of operation 83A.2 XLAUI/CAUI-10 link block diagram |
143 | 83A.3 XLAUI/CAUI-10 electrical characteristics 83A.3.1 Signal levels 83A.3.2 Signal paths 83A.3.2a EEE operation |
144 | 83A.3.3 Transmitter characteristics 83A.3.3.1 Output amplitude 83A.3.3.1.1 Amplitude and swing 83A.3.3.6 Global transmit disable function 83A.3.4 Receiver characteristics |
145 | 83A.3.4.2 Input signal definition 83A.3.4.5 AC coupling 83A.3.4.6 Jitter tolerance 83A.3.4.7 Global energy detect function 83A.4 Interconnect characteristics |
146 | 83A.5 Electrical parameter measurement methods 83A.5.1 Transmit jitter 83A.5.2 Receiver tolerance |
147 | 83A.6 Environmental specifications 83A.6.4 Electromagnetic compatibility 83A.6.5 Temperature and humidity 83A.7 Protocol implementation conformance statement (PICS) proforma for Annex 83A, 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten- lane Attachment Unit Interface (CAUI-10) 83A.7.1 Introduction |
148 | 83A.7.2 Identification 83A.7.2.2 Protocol summary 83A.7.3 Major capabilities/options 83A.7.4 XLAUI/CAUI-10 transmitter requirements |
149 | 83A.7.5 XLAUI/CAUI-10 receiver requirements 83A.7.6 Electrical measurement methods |
151 | Annex 83B (normative) Chip-to-module 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten-lane Attachment Unit Interface (CAUI-10) 83B.1 Overview |
152 | 83B.2 Compliance point specifications for chip-to-module XLAUI/CAUI-10 |
153 | 83B.2.1 Module specifications 83B.2.2 Host specifications 83B.2.3 Host input signal tolerance |
154 | 83B.3 Environmental specifications 83B.3.4 Electromagnetic compatibility 83B.3.5 Temperature and humidity 83B.4 Protocol implementation conformance statement (PICS) proforma for Annex 83B, Chip-to-module 40 Gb/s Attachment Unit Interface (XLAUI) and 100 Gb/s ten-lane Attachment Unit Interface (CAUI-10) |
155 | 83B.4.1 Introduction 83B.4.2 Identification 83B.4.2.2 Protocol summary 83B.4.3 Major capabilities/options 83B.4.4 Module requirements 83B.4.5 Host requirements |
157 | Annex 83C (informative) PMA sublayer partitioning examples 83C.1 Partitioning examples with FEC 83C.1.2 FEC implemented with PMD |
158 | 83C.1a Partitioning examples with RS-FEC 83C.1a.2 Single CAUI-10 with RS-FEC |
159 | 83C.2 Partitioning examples without FEC 83C.2.2 Single XLAUI/CAUI-4 without FEC |
160 | 83C.2.3 Separate SERDES for optical module interface |
161 | Annex 83D (normative) Chip-to-chip 100 Gb/s four-lane Attachment Unit Interface (CAUI-4) 83D.1 Overview |
163 | 83D.2 CAUI-4 chip-to-chip compliance point definition 83D.3 CAUI-4 chip-to-chip electrical characteristics 83D.3.1 CAUI-4 transmitter characteristics 83D.3.1.1 Transmitter equalization settings |
166 | 83D.3.2 Optional EEE operation 83D.3.3 CAUI-4 receiver characteristics 83D.3.3.1 Receiver interference tolerance |
167 | 83D.3.3.2 Transmitter equalization feedback (optional) |
168 | 83D.3.4 Global energy detect function for optional EEE operation 83D.4 CAUI-4 chip-to-chip channel characteristics |
169 | 83D.5 Example usage of the optional transmitter equalization feedback 83D.5.1 Overview |
170 | 83D.5.2 Tuning equalization settings on lane 0 in the transmit direction |
171 | 83D.5.3 Tuning equalization settings on lane 0 in the receive direction |
172 | 83D.6 Protocol implementation conformance statement (PICS) proforma for Annex 83D, Chip-to-chip 100 Gb/s four-lane Attachment Unit Interface (CAUI-4) 83D.6.1 Introduction 83D.6.2 Identification 83D.6.2.1 Implementation identification 83D.6.2.2 Protocol summary |
173 | 83D.6.3 Major capabilities/options 83D.6.4 PICS proforma tables for chip-to-chip 100 Gb/s four-lane Attachment Unit Interface (CAUI-4) 83D.6.4.1 Transmitter |
174 | 83D.6.4.2 Receiver 83D.6.4.3 Channel |
175 | Annex 83E (normative) Chip-to-module 100 Gb/s four-lane Attachment Unit Interface (CAUI-4) 83E.1 Overview |
177 | 83E.1.1 Bit error ratio 83E.2 CAUI-4 chip-to-module compliance point definitions |
178 | 83E.3 CAUI-4 chip-to-module electrical characteristics 83E.3.1 CAUI-4 host output characteristics |
179 | 83E.3.1.1 Signaling rate and range 83E.3.1.2 Signal levels 83E.3.1.3 Output return loss |
181 | 83E.3.1.4 Differential termination mismatch 83E.3.1.5 Transition time 83E.3.1.6 Host output eye width and eye height 83E.3.1.6.1 Reference receiver for host output eye width and eye height evaluation |
183 | 83E.3.2 CAUI-4 module output characteristics |
184 | 83E.3.2.1 Module output eye width and eye height 83E.3.2.1.1 Reference receiver for module output eye width and eye height evaluation 83E.3.3 CAUI-4 host input characteristics |
185 | 83E.3.3.1 Input return loss |
187 | 83E.3.3.2 Host stressed input test 83E.3.3.2.1 Host stressed input test procedure |
189 | 83E.3.4 CAUI-4 module input characteristics 83E.3.4.1 Module stressed input test 83E.3.4.1.1 Module stressed input test procedure |
192 | 83E.4 CAUI-4 measurement methodology 83E.4.1 HCB / MCB characteristics 83E.4.2 Eye width and eye height measurement method |
193 | 83E.4.2.1 Vertical eye closure |
194 | 83E.5 Protocol implementation conformance statement (PICS) proforma for Annex 83E, Chip-to-module 100 Gb/s four-lane Attachment Unit Interface (CAUI-4) 83E.5.1 Introduction 83E.5.2 Identification 83E.5.2.1 Implementation identification 83E.5.2.2 Protocol summary |
195 | 83E.5.3 Major capabilities/options 83E.5.4 PICS proforma tables for chip-to-module 100 Gb/s four-lane Attachment Unit Interface (CAUI-4) 83E.5.4.1 Host output |
196 | 83E.5.4.2 Module output 83E.5.4.3 Host input 83E.5.4.4 Module input |
199 | Annex 93A (normative) Specification methods for electrical channels 93A.1 Channel Operating Margin |