IPC 3408:1996
$27.95
General Requirements for Anisotropically Conductive Adhesive Films
| Published By | Publication Date | Number of Pages |
| IPC | 1996-11-01 | 21 |
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
