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IPC 9707-AMD1:2018

IPC 9707-AMD1:2018

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Spherical Bend Test Method for Characterization of Board Level Interconnects

Published By Publication Date Number of Pages
IPC 2018-05 7
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IPC/JEDEC-9707-AM1 is an amendment which clarifies that the standard is only applicable to transient bending during short-term test operations. The standard specifies a common method of establishing strain limits of board-level device interconnects under spherical transient bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations.

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IPC 9707-AMD1:2018
$9.10