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IPC 9707:2011

IPC 9707:2011

$45.50

Spherical Bend Test Method for Characterization of Board Level Interconnects

Published By Publication Date Number of Pages
IPC 2011-09-01 22
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This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.

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IPC 9707:2011
$45.50