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IPC SMC-TR-001:1989

IPC SMC-TR-001:1989

$38.35

Introduction to Tape Automated Bonding & Fine Pitch Technology

Published By Publication Date Number of Pages
IPC 1989-01-01 73
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This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.

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IPC SMC-TR-001:1989
$38.35