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IPC TP-1115:1998

IPC TP-1115:1998

$43.55

Selection and Implementation Strategy for a Low-Residue No-Clean Process

Published By Publication Date Number of Pages
IPC 1998-12-01 116
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This document provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concerns of process engineers and others coming into the field of low-residue processes from two different areas: those who currently clean finished electronic assemblies using water-based semi-aqueous or other environmentally acceptable solvents and defluxing technologies; or those who use a standard residue level (SR) no-clean assembly process. Both types of manufacturers should understand the advantages and pitfalls of using low-residue soldering materials. This guide allows electronics manufacturers to choose the process/materials that will best suit their needs.

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IPC TP-1115:1998
$43.55