IPC WP-023:2018
$45.50
IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface
Published By | Publication Date | Number of Pages |
IPC | 2018-05 | 24 |
IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures
IPC-WP-023 white paper provides an investigation of these issues using data collected from multiple printed board manufacturers and research conducted by the author.