JIS C 0099:2005
$24.05
Environmental testing: Tests – Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
| Published By | Publication Date | Number of Pages |
| JIS | 2005-03-20 | 31 |
| Published Code | JIS |
|---|---|
| Published By | Japanese Industrial Standards |
| Publication Date | 2005-03-20 |
| Pages Count | 31 |
| Language | English |
| File Size | 1.1 MB |
| ICS Codes | 19.040 - Environmental testing 25.160.50 - Brazing and soldering 31.190 - Electronic component assemblies |
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