JIS C 0806-3:2010
$35.10
Packaging of Components for Automatic Handling – Part 3: Packaging of Surface Mount Components on Continuous Tapes
Published By | Publication Date | Number of Pages |
JIS | 2010-05-20 | 27 |
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This Standard is applicable to the tape packaging of electronic components used for automatic handling without leads or with lead stumps which are intended to be connected to electronic circuits.
NOTE 1 The components with lead stumps mean the generic name of surface mount components with leads as compared with the surface mount components without leads.
NOTE 2 The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:
IEC 60286-3 : 2007 Packaging of components for automatic handling—part 3: Packaging of surface mount components on continuous tapes (IDT)
The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC GUIDE 21-1.
Published Code | JIS |
---|---|
Published By | Japanese Industrial Standards |
Publication Date | 2010-05-20 |
Pages Count | 27 |
Language | English |
File Size | 993.3 KB |
ICS Codes | 31.020 - Electronic components in general 31.240 - Mechanical structures for electronic equipment |
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