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JIS C 5070:2009

JIS C 5070:2009

$16.90

Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide

Published By Publication Date Number of Pages
JIS 2009-12-21 13
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Scope and object

This Standard describes the transportation and storage conditions for surface mounting devices (hereafter referred to as "SMDs") that are fulfilled and used in order to enable trouble-free processing of surface mounting devices, both active and passive.

Conditions for printed boards are not taken into consideration.

The object of this Standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.

Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning" .

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

IEC 61760-2: 2007 Surface mounting technology-Part 2: Transportation and storage conditions of surface mounting devices (SMD )-Application guide (IDT)

The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21.

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JIS C 5070:2009
$16.90