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JIS C 60068-2-69:2009

JIS C 60068-2-69:2009

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Environmental testing – Part 2-69: Tests-Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Published By Publication Date Number of Pages
JIS 2009-12-21 27
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This Standard outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices.

These methods determine quantitatively the solderability of terminations on surface mounting devices.

JIS C 60068-2-54 is also available for surface mounting devices and should be consulted if applicable.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.

This Standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

NOTE: The International Standard corresponding to this Standard is as follows.

IEC 60068-2-69: 2007 Environmental testing-Part 2-69: Tests-Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IDT)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

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JIS C 60068-2-69:2009
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