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JIS C 6691:2009

$35.10

Thermal-links – Requirements and application guide

Published By Publication Date Number of Pages
JIS 2009-03-20 36
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This Standard specifies the requirements for thermal-links intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions, and the application guidance.

NOTE 1 The equipment above need not be designed to generate heat.

NOTE 2 The effectiveness of the protection against excessive temperature increase logically depends upon the mounting position and mounting method of a thermal-link as well as upon the current-carrying.

NOTE 3 Attention is drawn to the fact that the external creepage distance and clearance specified in table 3 may in some cases be smaller than those required by certain appliance or equipment standards.

In such cases, additional means should be provided when a thermal-link is mounted in the equipment in order to adjust the creepage distance and clearance to the values required by the relevant equipment standard.

This Standard may be applicable to thermal-links for use under conditions other than indoors, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this Standard.

This Standard may be applicable to thermal-links in their simplest forms (e.g. melting strip or melting wire), provided that molten materials expelled during function cannot adversely interfere with the safe use of the equipment, especially in the case of hand-held or portable equipment, irrespective of its direction and movement.

This Standard is applicable to thermal-links with a rated voltage of not exceeding 690 V (a.c. or d.c.) and a rated current of not exceeding 63 A.

The object of this Standard is as follows.

a) To establish uniform requirements for thermal-links

b) To specify test methods

c) To provide useful information for the application of thermal-links incorporated in equipment

This Standard is not applicable to thermal-links used under extreme conditions such as corrosive or explosive atmospheres.

This Standard is not applicable to thermal-links to be used in circuits on a.c. with a frequency of under 45 Hz or over 62 Hz.

NOTE 4 The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

IEC 60691 : 2002 Thermal-links – Requirements and application guide and Amendment 1 (2006) (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/lEC Guide 21.

JIS C 6691:2009
$35.10