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JIS Z 3197:2012

JIS Z 3197:2012

$47.45

Test methods for soldering fluxes

Published By Publication Date Number of Pages
JIS 2012-03-21 77
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This Standard specifies the test methods for soldering fluxes (hereafter referred to as "fluxes") mainly intended for connection of wiring and parts in electric and electronic apparatuses and communication devices.

NOTE: The International Standards corresponding to this Standard and the symbol of degree of correspondence are as follows.

ISO 9454-1: 1990 Soft soldering fluxes-Classification and requirementsPart 1: Classification, labelling and packaging

ISO 9455-1: 1990 Soft soldering fluxes-Test methods-Part 1: Determination of non-volatile matter, gravimetric method

ISO 9455-3: 1992 Soft soldering fluxes-Test methods-Part 3: Determination of acid value, potentiometric and visual titration methods

ISO 9455-5: 1992 Soft soldering fluxes-Test methods-Part 5: Copper mirror test

ISO 9455-6: 1995 Soft soldering fluxes-Test methods-Part 6: Determination and detection of halide (excluding fluoride) content

ISO 9455-10: 1998 Soft soldering fluxes-Test methods-Part 10: Flux efficacy tests, solder spread method

ISO 9455-13: 1996 Soft soldering fluxes-Test methods-Part 13: Determination of flux spattering

ISO 9455-14: 1991 Soft soldering fluxes-Test methods-Part 14: Assessment of tackiness of flux residues

ISO 9455-15: 1996 Soft soldering fluxes-Test methods-Part 15: Copper corrosion test

ISO 9455-16: 1998 Soft soldering fluxes-Test methods-Part 16: Flux efficacy tests, wetting balance method

ISO 9455-17: 2002 Soft soldering fluxes-Test methods-Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

ISO 12224-2: 1997 Flux cored solder wire-Specification and test methods- Part 2: Determination of flux content

IEC 61189-5: 2006 Test methods for electrical materials, interconnection structures and assemblies-Part 5: Test methods for printed board assemblies

IEC 61189-6: 2006 Test methods for electrical materials, interconnection structures and assemblies-Part 6: Test methods for materials used in manufacturing electronic assemblies

IEC 61190-1-1: 2002 Attachment materials for electronic assemblyPart 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Overall evaluation: MOD)

The symbols which denote the degree of correspondence in the contents between the relevant International Standards and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISOI/IEC Guide 21-1.

WARNING Persons carrying out tests based on this Standard should be familiar with normal laboratory practice.

This Standard does not purport to address all of the safety problems, if any, associated with its use.

It is the responsibility of the user of this Standard to establish appropriate safety and health practices.

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JIS Z 3197:2012
$47.45