🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
JIS Z 3284-4:2014

JIS Z 3284-4:2014

$33.15

Solder paste – Part 4: Test methods for wettability, solder ball and spread

Published By Publication Date Number of Pages
JIS 2014-06-20 32
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This Standard specifies the flux efficacy and de-wetting test, solderball test, spread test, wetting balance test and displacement detection wetting test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows. lEC 61189-5 : 2006 Test methods for electrical materials, interconnection structures and assemblies – Part 5 : Test methods for printed board assemblies (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

Related products

JIS Z 3284-4:2014
$33.15