SAE SSB 1_002:2014

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Environmental Tests and Associated Failure Mechanisms

Published By	Publication Date	Number of Pages
SAE	2014-09-12	13

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Categories: 19.040 - Environmental testing, 31.200 - Integrated circuits. Microelectronics, SAE

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Description

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.

This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

Additional information

Published Code	SAE
Published By	SAE International, formerly Society of Automotive Engineers
Publication Date	2014-09-12
Pages Count	13
Language	English
Descriptors	Joining; Failure modes and effects analysis; Humidity; Environmental testing; Pressure; Physical examination; Integrated circuits; Logistics; Packaging
File Size	51.2 KB
ICS Codes	19.040 - Environmental testing 31.200 - Integrated circuits. Microelectronics

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SAE SSB 1_002:2014

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