SAE SSB 1_003A:2014

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Acceleration Factors

Published By	Publication Date	Number of Pages
SAE	2014-09-12	25

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Categories: 31.080 - Semiconductor devices, 31.200 - Integrated circuits. Microelectronics, SAE

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Description

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).

This document provides reference information concerning acceleration factors commonly used by device manufacturers to model failure rates in conjunction with statistical reliability monitoring. These acceleration factors are frequently used by OEMs in conjunction with physics of failure reliability analysis to assess the suitability of plastic encapsulated microcircuits and semiconductors for specific end use applications.

Additional information

Published Code	SAE
Published By	SAE International, formerly Society of Automotive Engineers
Publication Date	2014-09-12
Pages Count	25
Language	English
Descriptors	Joining; Humidity; Scale models; Aluminum alloys; Integrated circuits; Semiconductor devices; Fatigue; Alloys; Vehicle acceleration
File Size	92.2 KB
ICS Codes	31.080 - Semiconductor devices 31.200 - Integrated circuits. Microelectronics

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SAE SSB 1_003A:2014

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