TIA-455-129:1996 (R2014)

$27.30

Procedures for Applying Human Body Model Electrostatic Discharge Stress to Package Optoelectronic Components

Published By	Publication Date	Number of Pages
TIA	1996	28

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Description

This procedure covers ESD stressing of packaged optoelectronic
components only and is not applicable to purely electronic
components. For purposes of this document a packaged optoelectronic
components includes assembled packages which contain one or more
optoelectronic chips one or all of whose chip terminals are
directly connected to the package terminals. For semiconductor
lasers this package will, in most cases, include a rear facet
monitor and may include some monitoring circuitry.

This document applies t the ESD testing of any module circuitry,
including the rear facet monitor as well as the laser chip, since
such circuitry is an integral part of the laser package. This
document applies to all multi-frequency and single frequency laser
devices that utilize semiconductor technology. Therefore, it
includes, but is not limited to, Fabry-Perot lasers, distributed
feedback (DFB) lasers, distributed Bragg reflector (DBR) lasers,
and optoelectronic amplifiers and modulators. This document
specifically exludes lasers which utilize only active elements
other than semiconductor devices (for example, He-Ne, Ar, CO2, or
Nd: YAG lasers) The document also excludes packaged modules which
contain optoelectronic chips whose terminals are connected only to
internal nodes. Such devices are more properly treated as Hybrid
ICs for the purpose of ESD testing.

Finally, it should be noted that this document covers only the
application of Human Body Model (HBM) ESD testing. The application
of other types of ESD such as the Charged Device Model (CDM) and
the Field Induced Model (FIM) require different types of stressing
apparatus and different procedures. In Addition, these other ESD
stressing models tend to produce different types of failure
mechanisms in the components under test.

Additional information