31.020 - Electronic components in general
Showing 33–48 of 243 results
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IEC TS 62647-22:2013
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part…
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IEC TS 62647-21:2013
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part…
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IEC TS 62647-1:2012
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part…
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IEC TS 62564-1:2011
Process management for avionics – Aerospace qualified electronic components (AQEC) – Part 1: Integrated circuits…
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IEC TS 62564-1:2016
Process management for avionics – Aerospace qualified electronic components (AQEC) – Part 1: Integrated circuits…
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IEC TS 62500:2008
Process management for avionics – Defining and performing highly accelerated tests in aerospace systems –…
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IEC TS 62396-5:2008
Process management for avionics – Atmospheric radiation effects – Part 5: Guidelines for assessing thermal…
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IEC TS 62239-2:2017
Process management for avionics – Management plan – Part 2: Preparation and maintenance of an…
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IEC TS 62239-1:2015
Process management for avionics – Management plan – Part 1: Preparation and maintenance of an…
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IEC TS 62239-1:2012
Process management for avionics – Management plan – Part 1: Preparation and maintenance of an…
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IEC TR 63238-1:2019
Process management for avionics – Electronics design – Part 1: Electrical signal properties, naming conventions…
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IEC TR 62635:2012
Guidelines for end-of-life information provided by manufacturers and recyclers and for recyclability rate calculation of…
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IEC TR 62396-8:2020
Process management for avionics – Atmospheric radiation effects – Part 8: Proton, electron, pion, muon,…
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IEC TR 62396-7:2017
Process management for avionics – Atmospheric radiation effects – Part 7: Management of single event…
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IEC TR 62396-6:2017
Process management for avionics – Atmospheric radiation effects – Part 6: Extreme space weather –…
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IEC TR 62240-2:2018
Process management for avionics – Electronic components capability in operation – Part 2: Semiconductor microcircuit…