31.080.99 – Other semiconductor devices – PDF Standards Store ?u= Wed, 06 Nov 2024 02:05:53 +0000 en-US hourly 1 https://wordpress.org/?v=6.7.1 ?u=/wp-content/uploads/2024/11/cropped-icon-150x150.png 31.080.99 – Other semiconductor devices – PDF Standards Store ?u= 32 32 JIS C 8155:2010 ?u=/product/publishers/jis/jis-c-81552010/ Wed, 06 Nov 2024 02:05:53 +0000 LED modules for general lighting service-Performance requirements
Published By Publication Date Number of Pages
JIS 2010-09-21 34
]]> This Standard specifies the performance and marking of single white LEDs for generallighting service and LED modules for general lighting service.

However, LED luminaires and self-ballasted LED-lamps integrated by incorporating LED modules for general lighting service that are not assumed to be exchanged and maintained by general users are not included.

The electric power supplied to the LED modules for general lighting service shall be as follows.

a) Electric power obtained directly from a commercial power supply

b) Electric power obtained through a copper iron type transformer or an electronic transformer from a commercial power supply

c) Electric power of DC 250 V or less, or of AC 1 000 V or less at 50 Hz or 60 Hz in the range of supply voltage

The tests specified in this Standard are type tests excluding test methods that are to be performed on individual modules by the manufacturer in the manufacturing process.

]]> JIS C 6790:2010 ?u=/product/publishers/jis/jis-c-67902010/ Wed, 06 Nov 2024 02:04:32 +0000 Load test of a bolt-clamped Langevin vibrator using wattmeter method
Published By Publication Date Number of Pages
JIS 2010-05-20 21
]]> This Standard specifies the method for measuring the characteristics at load (internal mechanical vibration loss, electroacoustic conversion efficiency, etc.) of a bolt-clamped Langevin vibrator of which the resonance frequency is 10 kHz to 100 kHz (hereafter referred to as "vibrator") by the wattmeter method and calculating them.

]]> IEC TS 60747-19-2:2021 ?u=/product/publishers/iec/iec-ts-60747-19-22021/ Tue, 05 Nov 2024 20:09:20 +0000 Semiconductor devices - Part 19-2: Smart sensors - Indication of specifications of sensors and power supplies to drive smart sensors for low power operation
Published By Publication Date Number of Pages
IEC 2021-05-21 24
]]> IEC TS 60747-19-2:2021 provides a guideline of indication of specifications of a low-power sensor being a device or a module allowing autonomous power supply operation, which contributes to the low-power design of a smart sensing unit. Here, the smart sensing unit comprises a smart sensor, a terminal module, and a power supply, which can send output data of the smart sensor to the outside. This part also provides a guideline of indication of specifications of the power supply to drive the smart sensor(s) in the smart sensing unit. Based on these, the three components of the smart sensing unit can be easily selected and combined from the point-of-view of newly designed, low-power, smart sensing units.

]]> IEC TR 62258-7:2007 ?u=/product/publishers/iec/iec-tr-62258-72007/ Tue, 05 Nov 2024 20:04:43 +0000 Semiconductor die products - Part 7: XML schema for data exchange
Published By Publication Date Number of Pages
IEC 2007-08-23 30
]]> This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

]]> IEC TR 62258-4:2012 ?u=/product/publishers/iec/iec-tr-62258-42012/ Tue, 05 Nov 2024 20:04:43 +0000 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
Published By Publication Date Number of Pages
IEC 2012-08-08 42
]]> IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:
– wafers;
– singulated bare die;
– die and wafers with attached connection structures;
– minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein. This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.

]]> IEC TR 62258-3:2010 ?u=/product/publishers/iec/iec-tr-62258-32010/ Tue, 05 Nov 2024 20:04:41 +0000 Produits à puces de semi-conducteurs - Partie 3 : bonnes pratiques recommandées pour la manipulation, le conditionnement et le stockage
Published By Publication Date Number of Pages
IEC 2010-08-06 114
]]> Produits à puces de semi-conducteurs - Partie 3 : bonnes pratiques recommandées pour la manipulation, le conditionnement et le stockage
Published By Publication Date Number of Pages
IEC 2010-08-06 114
]]> IEC TR 60747-5-12:2021 ?u=/product/publishers/iec/iec-tr-60747-5-122021/ Tue, 05 Nov 2024 20:00:49 +0000 Semiconductor devices - Part 5-12: Optoelectronic devices - Light emitting diodes - Test method of LED efficiencies
Published By Publication Date Number of Pages
IEC 2021-10-13 92
]]> IEC TR 60747-5-12:2021(E) discusses the terminology and the measuring methods of optoelectronic efficiencies of single light emitting diode (LED) chip or package without phosphor. White LEDs for lighting applications are out of the scope of this part.
This technical report provides guidance on
– terminology of optoelectronic efficiencies of single LED chip or package without phosphor, such as the power efficiency (PE), the external quantum efficiency (EQE), the voltage efficiency (VE), the light extraction efficiency (LEE), the internal quantum efficiency (IQE), the injection efficiency (IE), and the radiative efficiency (RE);
– test methods of optoelectronic efficiencies of the PE, the EQE, the VE, the LEE, and the IQE;
– review of various IQE measurement methods reported so far in view of accuracy and practical applicability;
– the measuring method of the LED IQE based on the temperature-dependent electroluminescence (TDEL);
– the measuring method of the LED IQE based on the room-temperature reference-point method (RTRM);
– the measuring method of the radiative and nonradiative currents of an LED;
– the relationship between the IQE and the VE, which leads to introduction of a new LED efficiency, the active efficiency (AE) as AE = VE × IQE.

]]> IEC PAS 60747-17:2011 ?u=/product/publishers/iec/iec-pas-60747-172011/ Tue, 05 Nov 2024 19:58:52 +0000 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
Published By Publication Date Number of Pages
IEC 2011-11-17 44
]]> IEC/PAS 60747-17:2011(E) gives the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic and capacitive couplers. It specifies the principles of magnetic and capacitive coupling across an isolation barrier and the related requirements for basic isolation and reinforced insulation.

]]> IEC 63244-1:2021 ?u=/product/publishers/iec/iec-63244-12021/ Tue, 05 Nov 2024 19:57:56 +0000 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
Published By Publication Date Number of Pages
IEC 2021-09-14 70
]]> IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions.
This document also describes classifications of the wireless power transfer technologies.

]]> IEC 63229:2021 ?u=/product/publishers/iec/iec-632292021/ Tue, 05 Nov 2024 19:57:55 +0000 Semiconductor devices - Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
Published By Publication Date Number of Pages
IEC 2021-04-07 26
]]> IEC 63229:2021(E) gives guidelines for the definition and classification of defects in GaN epitaxial film grown on SiC substrate. They are identified and described on the basis of examples, mainly by schematic illustrations, optical microscope images, and transmission electron microscope images for these defects. This document covers only defects in as-grown GaN epitaxial film on SiC substrate and does not include defects caused by subsequent processes.

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