31.080.99 - Other semiconductor devices
Showing 49–64 of 299 results
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IEC 62047-40:2021
Semiconductor devices – Micro-electromechanical devices – Part 40:Test methods of micro-electromechanical inertial shock switch threshold…
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IEC 62047-3:2006
Dispositifs à semiconducteurs – Dispositifs micro électromécaniques – Partie 3 : éprouvette d’essai normalisée en…
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IEC 62047-38:2021
Semiconductor devices – Micro-electromechanical devices – Part 38: Test method for adhesion strength of metal…
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IEC 62047-37:2020
Dispositifs à semiconducteurs – Dispositifs micro électromécaniques – Partie 37: Méthodes d’essai d’environnement des couches…
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IEC 62047-36:2019
Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for…
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IEC 62047-34:2019
Semiconductor devices – Micro-electromechanical devices – Part 34: Test methods for MEMS piezoresistive pressure-sensitive device…
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IEC 62047-35:2019
Dispositifs à semiconducteurs – Dispositifs micro électromécaniques – Partie 35: Méthode d’essai des caractéristiques électriques…
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IEC 62047-32:2019
Dispositifs à semiconducteurs – Dispositifs micro électromécaniques – Partie 32: Méthode d’essai pour la vibration…
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IEC 62047-33:2019
Semiconductor devices – Micro-electromechanical devices – Part 33: MEMS piezoresistive pressure-sensitive device Published By Publication…
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IEC 62047-31:2019
Semiconductor devices – Micro-electromechanical devices – Part 31: Four-point bending test method for interfacial adhesion…
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IEC 62047-30:2017
Semiconductor devices – Micro-electromechanical devices – Part 30: Measurement methods of electro-mechanical conversion characteristics of…
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IEC 62047-2:2006
Dispositifs à semiconducteurs – Dispositifs micro électromécaniques – Partie 2 : méthode d’essai de traction…
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IEC 62047-29:2017
Semiconductor devices – Micro-electromechanical devices – Part 29: Electromechanical relaxation test method for freestanding conductive…
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IEC 62047-28:2017
Semiconductor devices – Micro-electromechanical devices – Part 28: Performance testing method of vibration-driven MEMS electret…
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IEC 62047-27:2017
Semiconductor devices – Micro-electromechanical devices – Part 27: Bond strength test for glass frit bonded…
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IEC 62047-25:2016
Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement…