31.180 - Printed circuits and boards
Showing 17–32 of 314 results
-
JIS C 6481:1996
Test methods of copper-clad laminates for printed wiring boards Published By Publication Date Number of…
-
JIS C 6480:1994
General rules of copper-clad laminates for printed wiring boards Published By Publication Date Number of…
-
JIS C 6472:1995
Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film) Published By Publication Date…
-
JIS C 6471:1995
Test methods of copper-clad laminates for flexible printed wiring boards Published By Publication Date Number…
-
JIS C 5603:1993
Terms and definitions for printed circuits Published By Publication Date Number of Pages JIS 1993-05-01…
-
JIS C 5017:1994
Flexible printed wiring boards – Single-sided, Double-sided Published By Publication Date Number of Pages JIS…
-
JIS C 5016:1994
Test methods for flexible printed wiring boards Published By Publication Date Number of Pages JIS…
-
JIS C 5014:1994
Multilayer printed wiring boards Published By Publication Date Number of Pages JIS 1994-01-01 42
-
JIS C 5013:1996
Single- and double-sided printed wiring boards Published By Publication Date Number of Pages JIS 1996-01-01…
-
JIS C 5012:1993
Test methods for printed wiring boards Published By Publication Date Number of Pages JIS 1993-05-01…
-
JIS C 5010:1994
General rules for printed wiring boards Published By Publication Date Number of Pages JIS 1994-01-01…
-
IEC TS 62878-2-4:2015
Substrat avec appareil(s) intégré(s) – Partie 2-4 : directives – Groupes d’éléments d’essai (TEG) Published…
-
IEC TS 62878-2-3:2015
Device embedded substrate – Part 2-3: Guidelines – Design guide Published By Publication Date Number…
-
IEC TS 62878-2-1:2015
Device embedded substrate – Part 2-1: Guidelines – General description of technology Published By Publication…
-
IEC TS 61189-3-301:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part…
-
IEC TR 63018:2015
Flexible printed circuit boards (FPCBs) – Method to decrease signal loss by using noise suppression…