However, the Standard does not specify tests for whiskers that may grow as a result of external mechanical stress.

This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria.

Where tests described in this Standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.

NOTE: The International Standard corresponding to this Standard is as follows.

IEC 60068-2-82: 2007 Environmental testing—Part 2-82: Tests—Test Tx: Whisker test methods for electronic and electric components (IDT)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

These methods determine quantitatively the solderability of terminations on surface mounting devices.

JIS C 60068-2-54 is also available for surface mounting devices and should be consulted if applicable.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.

This Standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

NOTE: The International Standard corresponding to this Standard is as follows.

IEC 60068-2-69: 2007 Environmental testing-Part 2-69: Tests-Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IDT)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method.

They are applicable to the lands of components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).

NOTE The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows.

IEC 60068-2-69:2017 Environmental testing—Part 2-69: Tests—Test Te/Tc:Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standards and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

This Standard is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or handling operations.

NOTE: The International Standard corresponding to this Standard is as follows.

lEC 60068-2-21: 2006 Environmental testing-Part 2-21: Tests-Test U: Robustness of terminations and integral mounting devices (IDT)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21-1.